Inventor
AKAIKE YASUHIKO
JP26 patents
⚠️ This page may combine multiple inventors who share the name “AKAIKE YASUHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOSHIBA KK
17 patentsUS6465809B1Oct 15, 2002
Bonding type semiconductor substrate, semiconductor light emitting element, and preparation process thereof
TOSHIBA KK99 citations98
US7037738B2May 2, 2006
Method of manufacturing a semiconductor light-emitting element
TOSHIBA KK147 citations97
US7364982B2Apr 29, 2008
Process for preparing a bonding type semiconductor substrate
TOSHIBA KK14 citations92
US7038245B2May 2, 2006
Semiconductor light emitting device having angled side surface
TOSHIBA KK16 citations92
US6528823B2Mar 4, 2003
Semiconductor light-emitting element and method of manufacturing the same
TOSHIBA KK39 citations92
US7667224B2Feb 23, 2010
Semiconductor light emitting device and semiconductor light emitting apparatus
TOSHIBA KK22 citations91
US6924513B2Aug 2, 2005
Light emitting element and manufacturing method for the same
TOSHIBA KK19 citations87
US7462869B2Dec 9, 2008
Semiconductor light emitting device and semiconductor light emitting apparatus
TOSHIBA KK19 citations83
US8969157B2Mar 3, 2015
Method of manufacturing semiconductor device having field plate electrode
TOSHIBA KK4 citations73
US7217635B2May 15, 2007
Process for preparing a bonding type semiconductor substrate
TOSHIBA KK7 citations73
US6373069B1Apr 16, 2002
Method for evaluating an epitaxial wafer for a light emitting device, recording medium readable by a computer and epitaxial wafer for a light emitting device
TOSHIBA KK13 citations72
US8357557B2Jan 22, 2013
Semiconductor light-emitting device and process for production thereof
TOSHIBA KK2 citations62
US9853023B2Dec 26, 2017
Semiconductor device and semiconductor package
TOSHIBA KK0 citations52
US9570439B2Feb 14, 2017
Semiconductor device and semiconductor package
TOSHIBA KK0 citations52
US8803179B2Aug 12, 2014
Semiconductor light emitting device
TOSHIBA KK0 citations52
US7329903B2Feb 12, 2008
Semiconductor light emitting element having three side surfaces inclined to connect the top and bottom surfaces of the transparent substrate
TOSHIBA KK0 citations52
US8816378B2Aug 26, 2014
Light emitting element and method for manufacturing same
TOSHIBA KK0 citations36
RENESAS ELECTRONICS CORP
3 patentsUS11031254B2Jun 8, 2021
Method for manufacturing a semiconductor device
RENESAS ELECTRONICS CORP0 citations62
US11024599B2Jun 1, 2021
Semiconductor device and method of manufacturing thereof
RENESAS ELECTRONICS CORP0 citations62
US11705344B2Jul 18, 2023
Method of manufacturing a resin-sealed semiconductor device
RENESAS ELECTRONICS CORP0 citations50