Inventor
SHIH CHIA-KAI
TW3 patents
Patents
3 patentsUS9343387B2May 17, 2016
Package on package structure and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD7 citations79
US9356008B2May 31, 2016
Semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD4 citations70
US9343421B2May 17, 2016
Semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations57