Inventor

CHIU TSENG-SHIN

TW2 patents

Patents

2 patents

US7408245B2Aug 5, 2008

IC package encapsulating a chip under asymmetric single-side leads

POWERTECH TECHNOLOGY INC14 citations78

US7633160B1Dec 15, 2009

Window-type semiconductor package to avoid peeling at moldflow entrance

POWERTECH TECHNOLOGY INC6 citations51