Inventor

ESCHER-POEPPEL IRMGARD

DE41 patents

⚠️ This page may combine multiple inventors who share the name “ESCHER-POEPPEL IRMGARD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ESCHER-POEPPEL IRMGARD

INFINEON TECHNOLOGIES AG

Method for making a sensor device using a graphene layer

System and method for packaged MEMS device having embedding arrangement, MEMS die, and grille

Method for making a sensor device using a graphene layer

Electronic structure with components connected by way of solderable connecting elements and method

Electronic device package including metal blocks

Method for producing a chip assemblage

Encapsulation method

Semiconductor device with a recessed bond pad

Semiconductor package

Semiconductor package and method of forming a semiconductor package

Predictive chip-maintenance

Method for fabricating a semiconductor flip-chip package

Semiconductor package system

Removable indicator structure in electronic chips of a common substrate for process adjustment

Semiconductor device

Method of reducing a sheet resistance in an electronic device, and an electronic device

Carrier sheet with adhesive film and method for producing semiconductor devices using the carrier sheet with adhesive film

Method for producing a power semiconductor module

External contact material for external contacts of a semiconductor device and method of making the same

Electronic device and method for fabricating an electronic device

Semiconductor arrangement, method for producing a number of chip assemblies, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement

Semiconductor arrangement, method for producing a semiconductor module, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement

Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement

BEER GOTTFRIED

Method for fabricating a semiconductor and semiconductor package

Method for fabricating a semiconductor and semiconductor package

Method for fabricating a semiconductor and semiconductor package

Method for fabricating a semiconductor and semiconductor package

Method of fabricating a semiconductor device

Method of fabricating a semiconductor device with encapsulant

INTEL DEUTSCHLAND GMBH

Method for fabricating a semiconductor and semiconductor package

Method for fabricating a semiconductor and semiconductor package

Method for fabricating a semiconductor and semiconductor package

POHL JENS

Stackable semiconductor package with encapsulant and electrically conductive feed-through

Semiconductor device

POEPPEL GERHARD JOSEF

Semiconductor device

Semiconductor device

FUERGUT EDWARD

Method for manufacturing an electronic module and an electronic module

Methods for manufacturing a chip package

ELIAN KLAUS

Method for making a sensor device using a graphene layer

INFINEON TECHNOLOGIES AUSTRIA AG

Additive manufacturing of a frontside or backside interconnect of a semiconductor die

INTEL MOBILE COMM GMBH

Method for fabricating a semiconductor device and semiconductor package