Inventor

CHU PO-TAU

TW2 patents

Patents

2 patents

US5633210AMay 27, 1997

Method for forming damage free patterned layers adjoining the edges of high step height apertures

TAIWAN SEMICONDUCTOR MFG27 citations83

US5719087AFeb 17, 1998

Process for bonding pad protection from damage

TAIWAN SEMICONDUCTOR MFG15 citations71