Inventor

CHANG WEI SEN

TW36 patents

⚠️ This page may combine multiple inventors who share the name “CHANG WEI SEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHANG WEI SEN

TAIWAN SEMICONDUCTOR MFG CO LTD

Multi-die package with bridge layer and method for making the same

Semiconductor structure with conductive structure

Semiconductor device with discrete blocks

Integrated fan-out package and method of fabricating the same

Wafer level embedded heat spreader

Dual-sided integrated fan-out package

Semiconductor device with discrete blocks

Dual-sided integrated fan-out package

Semiconductor device with discrete blocks

Integrated fan-out package

Semiconductor device

Interconnect structures for wafer level package and methods of forming same

Method of forming an integrated circuit device including a pillar capped by barrier layer

Organic interposer including a dual-layer inductor structure and methods of forming the same

Multi-die package with bridge layer

Semiconductor device with discrete blocks

Semiconductor device with discrete blocks

Semiconductor device with discrete blocks

Wafer level embedded heat spreader

Semiconductor structure with conductive structure

Semiconductor structure with conductive structure

Organic interposer including a dual-layer inductor structure and methods of forming the same

Organic interposer including a dual-layer inductor structure and methods of forming the same

Chip package with fan-out structure

Methods for making multi-die package with bridge layer

Wafer level embedded heat spreader

Dual-sided integrated fan-out package

Structure and formation method of chip package with fan-out structure

Method for forming semiconductor structure

Interconnect structures for wafer level package and methods of forming same

CHANG WEI SEN

Method of forming Cu pillar capped by barrier layer

Methods and apparatus for solder on slot connections in package on package structures

Integrated circuit device including a copper pillar capped by barrier layer

TAIWAN SEMICONDUCTOR MFG

Integrated circuit device including a copper pillar capped by barrier layer and method of forming the same

Peripheral electrical connection of package on package

HSIAO CHING-WEN

Semiconductor device with discrete blocks