Inventor

SAKITA YUSUKE

JP2 patents

Patents

2 patents

US11289442B2Mar 29, 2022

Gold-coated silver bonding wire and manufacturing method thereof, and semiconductor device and manufacturing method thereof

TANAKA ELECTRONICS IND0 citations53

US10195697B2Feb 5, 2019

Palladium (Pd)-coated copper wire for ball bonding

TANAKA ELECTRONICS IND0 citations47