Inventor
OBENG YAW S
US29 patents
⚠️ This page may combine multiple inventors who share the name “OBENG YAW S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
PSILOQUEST INC
10 patentsUS6684704B1Feb 3, 2004
Measuring the surface properties of polishing pads using ultrasonic reflectance
PSILOQUEST INC62 citations96
US6706383B1Mar 16, 2004
Polishing pad support that improves polishing performance and longevity
PSILOQUEST INC34 citations91
US6838169B2Jan 4, 2005
Polishing pad resistant to delamination
PSILOQUEST INC13 citations84
US6818301B2Nov 16, 2004
Thermal management with filled polymeric polishing pads and applications therefor
PSILOQUEST INC17 citations83
US6579604B2Jun 17, 2003
Method of altering and preserving the surface properties of a polishing pad and specific applications therefor
PSILOQUEST INC14 citations83
US6846225B2Jan 25, 2005
Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications therefor
PSILOQUEST INC10 citations73
US6821570B2Nov 23, 2004
Method for preparing a polymer for chemical mechanical polishing
PSILOQUEST INC7 citations73
US6688956B1Feb 10, 2004
Substrate polishing device and method
PSILOQUEST INC12 citations73
US6575823B1Jun 10, 2003
Polishing pad and method for in situ delivery of chemical mechanical polishing slurry modifiers and applications thereof
PSILOQUEST INC6 citations73
US7059946B1Jun 13, 2006
Compacted polishing pads for improved chemical mechanical polishing longevity
PSILOQUEST INC10 citations72
TEXAS INSTRUMENTS INC
6 patentsUS7943499B2May 17, 2011
FUSI integration method using SOG as a sacrificial planarization layer
TEXAS INSTRUMENTS INC1 citations62
US7700481B2Apr 20, 2010
Method for reliably removing excess metal during metal silicide formation
TEXAS INSTRUMENTS INC3 citations57
US7732313B2Jun 8, 2010
FUSI integration method using SOG as a sacrificial planarization layer
TEXAS INSTRUMENTS INC0 citations51
US7732312B2Jun 8, 2010
FUSI integration method using SOG as a sacrificial planarization layer
TEXAS INSTRUMENTS INC0 citations51
US7723199B2May 25, 2010
Method for cleaning post-etch noble metal residues
TEXAS INSTRUMENTS INC0 citations51
US7670952B2Mar 2, 2010
Method of manufacturing metal silicide contacts
TEXAS INSTRUMENTS INC0 citations41
LUCENT TECHNOLOGIES INC
4 patentsUS6048256AApr 11, 2000
Apparatus and method for continuous delivery and conditioning of a polishing slurry
LUCENT TECHNOLOGIES INC110 citations98
US6083838AJul 4, 2000
Method of planarizing a surface on a semiconductor wafer
LUCENT TECHNOLOGIES INC52 citations91
US6133158AOct 17, 2000
Process for removing alkali metals from solvents used in the manufacture of semiconductor wafers
LUCENT TECHNOLOGIES INC5 citations52
US6225135B1May 1, 2001
In-situ method for real time monitoring of chemical baths for transition metals with multi-channel electrodes
LUCENT TECHNOLOGIES INC0 citations38
AGERE SYST GUARDIAN CORP
3 patentsUS6439968B1Aug 27, 2002
Polishing pad having a water-repellant film theron and a method of manufacture therefor
AGERE SYST GUARDIAN CORP30 citations92
US6365503B1Apr 2, 2002
Method of improving electromigration in semiconductor device manufacturing processes
AGERE SYST GUARDIAN CORP6 citations61
US6406609B1Jun 18, 2002
Method of fabricating an integrated circuit
AGERE SYST GUARDIAN CORP4 citations59