Inventor

COHEN STEPHAN A

US18 patents

⚠️ This page may combine multiple inventors who share the name “COHEN STEPHAN A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

COHEN STEPHAN A

IBM

Carbon-free hydrogen silsesquioxane with dielectric constant less than 3.2 annealed in hydrogen for integrated circuits

DUV laser annealing and stabilization of SiCOH films

Ultra thin, single phase, diffusion barrier for metal conductors

Low-resistivity metallic interconnect structures

Interconnect structures containing nitrided metallic residues

Method of forming a ceramic diffusion barrier layer

Interconnect structures incorporating low-k dielectric barrier films

Shallow trench isolation for semiconductor devices

Nanoscale interconnect structure

Laminated diffusion barrier

Engineered interconnect dielectric caps having compressive stress and interconnect structures containing same

Diffusion barrier with low dielectric constant and semiconductor device containing same

Nanoscale interconnect structure

Interconnect structures containing nitrided metallic residues

Enhancing robustness of SOI substrate containing a buried N+ silicon layer for CMOS processing

Enhancing robustness of SOI substrate containing a buried N+ silicon layer for CMOS processing

BALSEANU MIHAELA

Multilayered low k cap with conformal gap fill and UV stable compressive stress properties

Multilayered low k cap with conformal gap fill and UV stable compressive stress properties