Inventor
HAGIWARA YOSHIHITO
JP8 patents
Patents
8 patentsUS9337166B2May 10, 2016
Wire bonding apparatus and bonding method
SHINKAWA KK9 citations82
US11189594B2Nov 30, 2021
Bonding apparatus and bonding method
SHINKAWA KK2 citations72
US11512411B2Nov 29, 2022
PTFE sheet and method for mounting die
SHINKAWA KK2 citations71
US10978420B2Apr 13, 2021
Semiconductor chip mounting apparatus and semiconductor chip mounting method
SHINKAWA KK4 citations71
US11069651B2Jul 20, 2021
Method of mounting die
SHINKAWA KK0 citations50
US10410992B2Sep 10, 2019
Ball forming device, wire-bonding apparatus, and ball formation method
SHINKAWA KK0 citations44
US9922952B2Mar 20, 2018
Method for producing semiconductor device, and wire-bonding apparatus
SHINKAWA KK0 citations40
US10566307B2Feb 18, 2020
Manufacturing method of semiconductor device
SHINKAWA KK0 citations37