Inventor
FRIEDEMANN MICHAEL
DE4 patents
Patents
4 patentsUS7745327B2Jun 29, 2010
Method of forming a copper-based metallization layer including a conductive cap layer by an advanced integration regime
ADVANCED MICRO DEVICES INC13 citations79
US6841468B2Jan 11, 2005
Method of forming a conductive barrier layer having improve adhesion and resistivity characteristics
ADVANCED MICRO DEVICES INC11 citations71
US7071096B2Jul 4, 2006
Method of forming a conductive barrier layer within critical openings by a final deposition step after a re-sputter deposition
ADVANCED MICRO DEVICES INC6 citations60
US6984294B2Jan 10, 2006
Method of forming a conductive barrier layer having improved coverage within critical openings
ADVANCED MICRO DEVICES INC6 citations60