Inventor

BEYER GERALD PETER

BE3 patents

Patents

3 patents

US10886252B2Jan 5, 2021

Method of bonding semiconductor substrates

IMEC VZW8 citations78

US11810892B2Nov 7, 2023

Method of direct bonding semiconductor components

IMEC VZW0 citations46

US10141284B2Nov 27, 2018

Method of bonding semiconductor substrates

IMEC VZW0 citations36