Inventor

SHI LINBO

CN2 patents

⚠️ This page may combine multiple inventors who share the name “SHI LINBO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SEMICONDUCTOR MFG INT BEIJING CORP

1 patent

US10134698B2Nov 20, 2018

Bonding pad structure, bonding ring structure, and MEMS device packaging method

SEMICONDUCTOR MFG INT BEIJING CORP4 citations68

SEMICONDUCTOR MFG INT SHANGHAI CORP

1 patent

US10381398B2Aug 13, 2019

Method for manufacturing semiconductor apparatus

SEMICONDUCTOR MFG INT SHANGHAI CORP0 citations44