Inventor
SHIRAISHI YASUSHI
JP55 patents
⚠️ This page may combine multiple inventors who share the name “SHIRAISHI YASUSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
OKI ELECTRIC IND CO LTD
24 patentsUS6208021B1Mar 27, 2001
Semiconductor device, manufacturing method thereof and aggregate type semiconductor device
OKI ELECTRIC IND CO LTD187 citations99
US6201266B1Mar 13, 2001
Semiconductor device and method for manufacturing the same
OKI ELECTRIC IND CO LTD116 citations99
US6573598B2Jun 3, 2003
Semiconductor device and method of fabricating the same
OKI ELECTRIC IND CO LTD132 citations98
US6673651B2Jan 6, 2004
Method of manufacturing semiconductor device including semiconductor elements mounted on base plate
OKI ELECTRIC IND CO LTD63 citations96
US6476501B1Nov 5, 2002
Semiconductor device, manufacturing method for semiconductor device and mounting method for the same
OKI ELECTRIC IND CO LTD33 citations96
US6262482B1Jul 17, 2001
Semiconductor device
OKI ELECTRIC IND CO LTD104 citations96
US7479690B2Jan 20, 2009
Semiconductor device
OKI ELECTRIC IND CO LTD37 citations93
US7405138B2Jul 29, 2008
Manufacturing method of stack-type semiconductor device
OKI ELECTRIC IND CO LTD28 citations93
US7019397B2Mar 28, 2006
Semiconductor device, manufacturing method of semiconductor device, stack type semiconductor device, and manufacturing method of stack type semiconductor device
OKI ELECTRIC IND CO LTD23 citations93
US6613694B2Sep 2, 2003
Semiconductor device, manufacturing method for semiconductor device and mounting method for the same
OKI ELECTRIC IND CO LTD13 citations93
US6852564B2Feb 8, 2005
Semiconductor device and method of fabricating the same
OKI ELECTRIC IND CO LTD40 citations92
US6495916B1Dec 17, 2002
Resin-encapsulated semiconductor device
OKI ELECTRIC IND CO LTD38 citations92
US6403398B2Jun 11, 2002
Semiconductor device, manufacturing method thereof and aggregate type semiconductor device
OKI ELECTRIC IND CO LTD30 citations92
US6911722B2Jun 28, 2005
Resin-molded semiconductor device having posts with bumps
OKI ELECTRIC IND CO LTD10 citations74
US6258621B1Jul 10, 2001
Method of fabricating a semiconductor device having insulating tape interposed between chip and chip support
OKI ELECTRIC IND CO LTD10 citations74
US6534845B1Mar 18, 2003
Semiconductor device
OKI ELECTRIC IND CO LTD10 citations72
US6002181ADec 14, 1999
Structure of resin molded type semiconductor device with embedded thermal dissipator
OKI ELECTRIC IND CO LTD11 citations72
US7307337B2Dec 11, 2007
Resin-molded semiconductor device having posts with bumps and method for fabricating the same
OKI ELECTRIC IND CO LTD3 citations63
US6653218B2Nov 25, 2003
Method of fabricating resin-encapsulated semiconductor device
OKI ELECTRIC IND CO LTD5 citations62
US7427810B2Sep 23, 2008
Semiconductor device including semiconductor element mounted on another semiconductor element
OKI ELECTRIC IND CO LTD0 citations52
US7314779B2Jan 1, 2008
Semiconductor device, manufacturing method for semiconductor device and mounting method for the same
OKI ELECTRIC IND CO LTD0 citations52
US6680535B2Jan 20, 2004
Semiconductor device, manufacturing method for semiconductor device and mounting method for the same
OKI ELECTRIC IND CO LTD0 citations52
US6097083AAug 1, 2000
Semiconductor device which is crack resistant
OKI ELECTRIC IND CO LTD1 citations52
US5969410AOct 19, 1999
Semiconductor IC device having chip support element and electrodes on the same surface
OKI ELECTRIC IND CO LTD0 citations52
FUJIFILM CORP
11 patentsUS11163145B2Nov 2, 2021
Observation device, observation method, and observation device control program
FUJIFILM CORP4 citations73
US10466462B2Nov 5, 2019
Phase-contrast microscope and imagine method
FUJIFILM CORP2 citations73
US10231658B2Mar 19, 2019
Endoscope system, processor device for endoscope system, operation method for endoscope system, and operation method for processor device
FUJIFILM CORP3 citations73
US10052015B2Aug 21, 2018
Endoscope system, processor device, and method for operating endoscope system
FUJIFILM CORP3 citations73
US11402607B2Aug 2, 2022
Observation device, observation method, and observation device control program
FUJIFILM CORP1 citations63
US12136258B2Nov 5, 2024
Information processing apparatus, method for operating information processing apparatus, and operating program of information processing apparatus
FUJIFILM CORP0 citations52
US12061326B2Aug 13, 2024
Observation device, observation method, and observation device control program
FUJIFILM CORP0 citations52
US11971530B2Apr 30, 2024
Observation apparatus, method of operating observation apparatus, and observation control program
FUJIFILM CORP0 citations52
US11480777B2Oct 25, 2022
Observation device, observation method, and observation device control program storage medium
FUJIFILM CORP0 citations52
US10831009B2Nov 10, 2020
Phase contrast microscope and imaging method
FUJIFILM CORP0 citations52
US9907493B2Mar 6, 2018
Endoscope system processor device, endoscope system, operation method for endoscope system processor device, and operation method for endoscope system
FUJIFILM CORP0 citations52
OKI SEMICONDUCTOR CO LTD
6 patentsUS7932597B2Apr 26, 2011
Semiconductor device and manufacturing method thereof
OKI SEMICONDUCTOR CO LTD7 citations84
US7598618B2Oct 6, 2009
Semiconductor device
OKI SEMICONDUCTOR CO LTD17 citations84
US7977229B2Jul 12, 2011
Method for fabricating resin-molded semiconductor device having posts with bumps
OKI SEMICONDUCTOR CO LTD6 citations74
US8008129B2Aug 30, 2011
Method of making semiconductor device packaged by sealing resin member
OKI SEMICONDUCTOR CO LTD2 citations63
US7723832B2May 25, 2010
Semiconductor device including semiconductor elements mounted on base plate
OKI SEMICONDUCTOR CO LTD2 citations63
US7592690B2Sep 22, 2009
Semiconductor device including semiconductor elements mounted on base plate
OKI SEMICONDUCTOR CO LTD0 citations52
NEC CORP
5 patentsUS5810964ASep 22, 1998
Chemical mechanical polishing device for a semiconductor wafer
NEC CORP105 citations98
US6392262B1May 21, 2002
Compound semiconductor device having low-resistive ohmic contact electrode and process for producing ohmic electrode
NEC CORP20 citations93
US5604356AFeb 18, 1997
Superlattice ohmic contact on a compound semiconductor layer
NEC CORP22 citations93
US5294565AMar 15, 1994
Crystal growth method of III - V compound semiconductor
NEC CORP12 citations74
US6630972B1Oct 7, 2003
Transmission liquid crystal panel to block ray of light toward thin film transistors with a light blocking film
NEC CORP6 citations63
CASIO COMPUTER CO LTD
3 patentsTERUI MAKOTO
1 patentShowing the top 50 of 55 patents by PatentIndex Score.