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Inventor

GRIEF MALCOLM

US25 patents
⚠️ This page may combine multiple inventors who share the name “GRIEF MALCOLM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICRON TECHNOLOGY INC

18 patents
US7026835B2Apr 11, 2006

Engagement probe having a grouping of projecting apexes for engaging a conductive pad

MICRON TECHNOLOGY INC109 citations99
US5523697AJun 4, 1996

Testing apparatus for engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof

MICRON TECHNOLOGY INC129 citations99
US5514245AMay 7, 1996

Method for chemical planarization (CMP) of a semiconductor wafer to provide a planar surface free of microscratches

MICRON TECHNOLOGY INC276 citations99
US6686758B1Feb 3, 2004

Engagement probe and apparatuses configured to engage a conductive pad

MICRON TECHNOLOGY INC13 citations92
US5166093ANov 24, 1992

Method to reduce the reflectivity of a semi-conductor metallic surface

MICRON TECHNOLOGY INC39 citations92
US6614249B1Sep 2, 2003

Methods of forming apparatuses and a method of engaging electrically conductive test pads on a semiconductor substrate

MICRON TECHNOLOGY INC7 citations82
US6392426B2May 21, 2002

Methods of forming apparatuses and a method of engaging electrically conductive test pads on a semiconductor substrate

MICRON TECHNOLOGY INC10 citations82
US6124721ASep 26, 2000

Method of engaging electrically conductive test pads on a semiconductor substrate

MICRON TECHNOLOGY INC7 citations82
US7098475B2Aug 29, 2006

Apparatuses configured to engage a conductive pad

MICRON TECHNOLOGY INC2 citations74
US6833727B2Dec 21, 2004

Method and apparatus for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability

MICRON TECHNOLOGY INC3 citations74
US6670819B2Dec 30, 2003

Methods of engaging electrically conductive pads on a semiconductor substrate

MICRON TECHNOLOGY INC3 citations74
US6657450B2Dec 2, 2003

Methods of engaging electrically conductive test pads on a semiconductor substrate removable electrical interconnect apparatuses, engagement probes and removable engagement probes

MICRON TECHNOLOGY INC4 citations74
US7330036B2Feb 12, 2008

Engagement Probes

MICRON TECHNOLOGY INC1 citations63
US7116118B2Oct 3, 2006

Method and apparatus for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability

MICRON TECHNOLOGY INC0 citations63
US6573740B2Jun 3, 2003

Method of forming an apparatus configured to engage an electrically conductive pad on a semiconductive substrate and a method of engaging electrically conductive pads on a semiconductive substrate

MICRON TECHNOLOGY INC0 citations63
US6462571B1Oct 8, 2002

Engagement probes

MICRON TECHNOLOGY INC0 citations63
US6380754B1Apr 30, 2002

Removable electrical interconnect apparatuses including an engagement proble

MICRON TECHNOLOGY INC1 citations63
US6127195AOct 3, 2000

Methods of forming an apparatus for engaging electrically conductive pads and method of forming a removable electrical interconnect apparatus

MICRON TECHNOLOGY INC1 citations63

SPEEDFAM IPEC CORP

2 patents

AIR PROD & CHEM

2 patents

VERSUM MAT US LLC

2 patents

MICRON SEMICONDUCTOR INC

1 patent