Inventor

MURELLA KRISHNA P

US19 patents

⚠️ This page may combine multiple inventors who share the name “MURELLA KRISHNA P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MURELLA KRISHNA P

VERSUM MAT US LLC

Low oxide trench dishing chemical mechanical polishing

High oxide film removal rate shallow trench (STI) chemical mechanical planarization (CMP) polishing

Low oxide trench dishing chemical mechanical polishing

Low oxide trench dishing chemical mechanical polishing

Shallow trench isolation (STI) chemical mechanical planarization (CMP) polishing with tunable silicon oxide and silicon nitride removal rates

Oxide chemical mechanical planarization (CMP) polishing compositions

Shallow trench isolation (STI) chemical mechanical planarization (CMP) polishing with low abrasive concentration and a combination of chemical additives

Low oxide trench dishing chemical mechanical polishing

Composite particles, method of refining and use thereof

Low dishing oxide CMP polishing compositions for shallow trench isolation applications and methods of making thereof

Low oxide trench dishing shallow trench isolation chemical mechanical planarization polishing

Suppressing SiN removal rates and reducing oxide trench dishing for Shallow Trench Isolation (STI) process

Composite particles, method of refining and use thereof

Composite abrasive particles for chemical mechanical planarization composition and method of use thereof

Chemical mechanical planarization of films comprising elemental silicon

AIR PROD & CHEM

Composite abrasive particles for chemical mechanical planarization composition and method of use thereof

Composite abrasive particles for chemical mechanical planarization composition and method of use thereof

SPEEDFAM CORP

Two-step chemical-mechanical planarization for damascene structures on semiconductor wafers

SPEEDFAM IPEC CORP

Pad conditioning for copper-based semiconductor wafers