Inventor
TAMBOLI DNYANESH CHANDRAKANT
US16 patents
⚠️ This page may combine multiple inventors who share the name “TAMBOLI DNYANESH CHANDRAKANT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
VERSUM MAT US LLC
7 patentsUS10253216B2Apr 9, 2019
Additives for barrier chemical mechanical planarization
VERSUM MAT US LLC4 citations71
US10894906B2Jan 19, 2021
Composite particles, method of refining and use thereof
VERSUM MAT US LLC0 citations61
US11643599B2May 9, 2023
Tungsten chemical mechanical polishing for reduced oxide erosion
VERSUM MAT US LLC0 citations52
US10421890B2Sep 24, 2019
Composite particles, method of refining and use thereof
VERSUM MAT US LLC0 citations51
US10669449B2Jun 2, 2020
Composite abrasive particles for chemical mechanical planarization composition and method of use thereof
VERSUM MAT US LLC0 citations50
US11111415B2Sep 7, 2021
Chemical mechanical planarization of films comprising elemental silicon
VERSUM MAT US LLC0 citations49
US10373842B2Aug 6, 2019
Composition and method used for chemical mechanical planarization of metals
VERSUM MAT US LLC0 citations34
AIR PROD & CHEM
4 patentsUS10032644B2Jul 24, 2018
Barrier chemical mechanical planarization slurries using ceria-coated silica abrasives
AIR PROD & CHEM5 citations72
US10418247B2Sep 17, 2019
Composite abrasive particles for chemical mechanical planarization composition and method of use thereof
AIR PROD & CHEM1 citations61
US10109493B2Oct 23, 2018
Composite abrasive particles for chemical mechanical planarization composition and method of use thereof
AIR PROD & CHEM1 citations61
US7977121B2Jul 12, 2011
Method and composition for restoring dielectric properties of porous dielectric materials
AIR PROD & CHEM0 citations51
TAMBOLI DNYANESH CHANDRAKANT
3 patentsUS8765653B2Jul 1, 2014
Formulations and method for post-CMP cleaning
TAMBOLI DNYANESH CHANDRAKANT12 citations78
US9328318B2May 3, 2016
Method for wafer dicing and composition useful thereof
TAMBOLI DNYANESH CHANDRAKANT0 citations47
US8883701B2Nov 11, 2014
Method for wafer dicing and composition useful thereof
TAMBOLI DNYANESH CHANDRAKANT1 citations47