Inventor

BIELICK JAMES D

US19 patents

⚠️ This page may combine multiple inventors who share the name “BIELICK JAMES D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BIELICK JAMES D

IBM

Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device

Heatsink and package structures with fusible release layer

Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device

Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device

Electromagnetic shielding of heat sinks with shape-memory alloy grounding

Method of performing solder joint analysis of semi-conductor components

Electromagnetic shielding of heatsinks with spring press-fit pins

Facilitating reliable circuit board press-fit connector assembly fabrication

Dye and pry process for removing quad flat no-lead packages and bottom termination components

Heat sinks using memory shaping materials

Modified internal clearance(s) at connector pin aperture(s) of a circuit board

Localized rework using liquid media soldering

Shape-memory alloy lock for connectors

Hybrid socket warp indicator

Tool for shaping contact tab interconnects at a circuit card edge

Recondition process for BGA using flux

Dye and pry process for removing quad flat no-lead packages and bottom termination components

Detecting and correcting deficiencies in surface conditions for bonding applications

GLOBALFOUNDRIES INC

Apparatus and method for detaching a component from a mounting surface