Inventor
BRAUN DAVID J
US28 patents
⚠️ This page may combine multiple inventors who share the name “BRAUN DAVID J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
22 patentsUS10575448B1Feb 25, 2020
Electromagnetic shielding of heat sinks with shape-memory alloy grounding
IBM20 citations92
US11699884B2Jul 11, 2023
Electromagnetic shielding of heatsinks with spring press-fit pins
IBM4 citations72
US10677856B2Jun 9, 2020
Facilitating reliable circuit board press-fit connector assembly fabrication
IBM2 citations70
US10262907B1Apr 16, 2019
Dye and pry process for removing quad flat no-lead packages and bottom termination components
IBM2 citations70
US11742602B2Aug 29, 2023
Press-fit rework method
IBM0 citations62
US11733154B2Aug 22, 2023
Thermal interface material detection through compression
IBM0 citations62
US11555793B1Jan 17, 2023
Anti-vibration fixturing system for nondestructive testing
IBM0 citations62
US11424562B2Aug 23, 2022
Press-fit insertion method
IBM0 citations62
US9265155B2Feb 16, 2016
Flexible rework device
IBM2 citations62
US11175100B2Nov 16, 2021
Heat sinks using memory shaping materials
IBM0 citations61
US12256494B2Mar 18, 2025
Modified internal clearance(s) at connector pin aperture(s) of a circuit board
IBM0 citations60
US11445650B2Sep 13, 2022
Localized rework using liquid media soldering
IBM0 citations60
US11641717B2May 2, 2023
Soldering of end chip components in series
IBM0 citations57
US6822468B2Nov 23, 2004
Method and apparatus for implementing printed circuit board high potential testing to identify latent defects
IBM2 citations54
US9554474B2Jan 24, 2017
Debug probing device and technique for use with flexible rework device
IBM0 citations52
US11647591B2May 9, 2023
Compliant pin surface mount technology pad for rework
IBM0 citations51
US12100910B2Sep 24, 2024
Shape-memory alloy lock for connectors
IBM0 citations50
US11906574B2Feb 20, 2024
Hybrid socket warp indicator
IBM0 citations50
US11245238B2Feb 8, 2022
Tool for shaping contact tab interconnects at a circuit card edge
IBM0 citations49
US10881007B2Dec 29, 2020
Recondition process for BGA using flux
IBM0 citations49
US10593601B2Mar 17, 2020
Dye and pry process for removing quad flat no-lead packages and bottom termination components
IBM0 citations49
US11268809B2Mar 8, 2022
Detecting and correcting deficiencies in surface conditions for bonding applications
IBM0 citations48
BRAUN DAVID J
5 patentsUSH1471HAug 1, 1995
Metal substrate double sided circuit board
BRAUN DAVID J52 citations89
US8133124B2Mar 13, 2012
System and method for a golf tournament
BRAUN DAVID J9 citations79
US8572498B2Oct 29, 2013
System and method for influencing an on-going event
BRAUN DAVID J3 citations57
US9032617B2May 19, 2015
Method for manufacturing split flex cable
BRAUN DAVID J0 citations50
US8106300B2Jan 31, 2012
Split flex cable
BRAUN DAVID J0 citations50