P

Inventor

BRAUN DAVID J

US28 patents
⚠️ This page may combine multiple inventors who share the name “BRAUN DAVID J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

22 patents
US10575448B1Feb 25, 2020

Electromagnetic shielding of heat sinks with shape-memory alloy grounding

IBM20 citations92
US11699884B2Jul 11, 2023

Electromagnetic shielding of heatsinks with spring press-fit pins

IBM4 citations72
US10677856B2Jun 9, 2020

Facilitating reliable circuit board press-fit connector assembly fabrication

IBM2 citations70
US10262907B1Apr 16, 2019

Dye and pry process for removing quad flat no-lead packages and bottom termination components

IBM2 citations70
US11742602B2Aug 29, 2023

Press-fit rework method

IBM0 citations62
US11733154B2Aug 22, 2023

Thermal interface material detection through compression

IBM0 citations62
US11555793B1Jan 17, 2023

Anti-vibration fixturing system for nondestructive testing

IBM0 citations62
US11424562B2Aug 23, 2022

Press-fit insertion method

IBM0 citations62
US9265155B2Feb 16, 2016

Flexible rework device

IBM2 citations62
US11175100B2Nov 16, 2021

Heat sinks using memory shaping materials

IBM0 citations61
US12256494B2Mar 18, 2025

Modified internal clearance(s) at connector pin aperture(s) of a circuit board

IBM0 citations60
US11445650B2Sep 13, 2022

Localized rework using liquid media soldering

IBM0 citations60
US11641717B2May 2, 2023

Soldering of end chip components in series

IBM0 citations57
US6822468B2Nov 23, 2004

Method and apparatus for implementing printed circuit board high potential testing to identify latent defects

IBM2 citations54
US9554474B2Jan 24, 2017

Debug probing device and technique for use with flexible rework device

IBM0 citations52
US11647591B2May 9, 2023

Compliant pin surface mount technology pad for rework

IBM0 citations51
US12100910B2Sep 24, 2024

Shape-memory alloy lock for connectors

IBM0 citations50
US11906574B2Feb 20, 2024

Hybrid socket warp indicator

IBM0 citations50
US11245238B2Feb 8, 2022

Tool for shaping contact tab interconnects at a circuit card edge

IBM0 citations49
US10881007B2Dec 29, 2020

Recondition process for BGA using flux

IBM0 citations49
US10593601B2Mar 17, 2020

Dye and pry process for removing quad flat no-lead packages and bottom termination components

IBM0 citations49
US11268809B2Mar 8, 2022

Detecting and correcting deficiencies in surface conditions for bonding applications

IBM0 citations48

BRAUN DAVID J

5 patents

BELTON THOMAS A

1 patent