Inventor
YOUNGER TIMOTHY P
US18 patents
⚠️ This page may combine multiple inventors who share the name “YOUNGER TIMOTHY P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
17 patentsUS10575448B1Feb 25, 2020
Electromagnetic shielding of heat sinks with shape-memory alloy grounding
IBM20 citations92
US11699884B2Jul 11, 2023
Electromagnetic shielding of heatsinks with spring press-fit pins
IBM4 citations72
US11310950B2Apr 19, 2022
Liquid metal infiltration rework of electronic assembly
IBM1 citations72
US11278977B2Mar 22, 2022
Liquid metal infiltration rework of electronic assembly
IBM2 citations72
US10677856B2Jun 9, 2020
Facilitating reliable circuit board press-fit connector assembly fabrication
IBM2 citations70
US10262907B1Apr 16, 2019
Dye and pry process for removing quad flat no-lead packages and bottom termination components
IBM2 citations70
US12016127B2Jun 18, 2024
Liquid metal infiltration rework of electronic assembly
IBM0 citations62
US11751369B2Sep 5, 2023
Liquid metal infiltration rework of electronic assembly
IBM0 citations62
US11175100B2Nov 16, 2021
Heat sinks using memory shaping materials
IBM0 citations61
US12256494B2Mar 18, 2025
Modified internal clearance(s) at connector pin aperture(s) of a circuit board
IBM0 citations60
US11445650B2Sep 13, 2022
Localized rework using liquid media soldering
IBM0 citations60
US12100910B2Sep 24, 2024
Shape-memory alloy lock for connectors
IBM0 citations50
US11906574B2Feb 20, 2024
Hybrid socket warp indicator
IBM0 citations50
US11245238B2Feb 8, 2022
Tool for shaping contact tab interconnects at a circuit card edge
IBM0 citations49
US10881007B2Dec 29, 2020
Recondition process for BGA using flux
IBM0 citations49
US10593601B2Mar 17, 2020
Dye and pry process for removing quad flat no-lead packages and bottom termination components
IBM0 citations49
US11268809B2Mar 8, 2022
Detecting and correcting deficiencies in surface conditions for bonding applications
IBM0 citations48