Inventor
KUAN HSAING-PIN
TW3 patents
Patents
3 patentsUS10879192B1Dec 29, 2020
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations81
US11031376B2Jun 8, 2021
Chip package and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12512451B2Dec 30, 2025
Semiconductor package and manufacturing method of the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51