Inventor

WANG YUNG-CHIH

TW56 patents

⚠️ This page may combine multiple inventors who share the name “WANG YUNG-CHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

27 patents

US9390965B2Jul 12, 2016

Air-gap forming techniques for interconnect structures

TAIWAN SEMICONDUCTOR MFG CO LTD12 citations93

US10991618B2Apr 27, 2021

Semiconductor device and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84

US10276498B2Apr 30, 2019

Interconnect structure with air-gaps

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84

US10109519B2Oct 23, 2018

Method of semiconductor integrated circuit fabrication

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84

US9716035B2Jul 25, 2017

Combination interconnect structure and methods of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84

US11842962B2Dec 12, 2023

Interconnect structure with air-gaps

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73

US11764106B2Sep 19, 2023

Semiconductor device and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73

US10700005B2Jun 30, 2020

Interconnect structure with air gaps

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73

US10325993B2Jun 18, 2019

Gate all around device and fabrication thereof

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73

US9633897B2Apr 25, 2017

Air-gap forming techniques for interconnect structures

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US9455178B2Sep 27, 2016

Method of semiconductor integrated circuit fabrication

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73

US9583434B2Feb 28, 2017

Metal line structure and method

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72

US9564396B2Feb 7, 2017

Semiconductor device and process

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72

US11495539B2Nov 8, 2022

Interconnect structure with air-gaps

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US10923424B2Feb 16, 2021

Interconnect structure with air-gaps

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US9875967B2Jan 23, 2018

Interconnect structure with air-gaps

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63

US12230534B2Feb 18, 2025

Semiconductor device and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12094946B2Sep 17, 2024

Gate all around device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12051646B2Jul 30, 2024

Metal line structure and method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US11302792B2Apr 12, 2022

Fabrication of gate all around device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US11101216B2Aug 24, 2021

Metal line structure and method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12125911B2Oct 22, 2024

Method of modulating stress of dielectric layers

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61

US11502196B2Nov 15, 2022

Stress modulation for dielectric layers

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61

US10763337B2Sep 1, 2020

Fabrication of gate all around device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52

US10622453B2Apr 14, 2020

Vertical MOS transistor

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52

US10269915B2Apr 23, 2019

Vertical MOS transistor and fabricating method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52

US10720526B2Jul 21, 2020

Stress modulation for dielectric layers

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51

ACER INC

12 patents

US9835382B2Dec 5, 2017

Thermal dissipation module

ACER INC5 citations84

US10303212B2May 28, 2019

Rotary combination module for tablet computer

ACER INC8 citations83

US11379021B2Jul 5, 2022

Heat dissipation module

ACER INC2 citations73

US10642322B2May 5, 2020

Heat dissipation module

ACER INC2 citations73

US10634435B2Apr 28, 2020

Thermal dissipation module

ACER INC1 citations73

US10563926B2Feb 18, 2020

Lattice boiler evaporator

ACER INC2 citations73

US10006471B2Jun 26, 2018

Fan module and electronic device using the same

ACER INC2 citations72

US12392560B2Aug 19, 2025

Thermal dissipation module

ACER INC0 citations62

US11852420B2Dec 26, 2023

Thermal dissipation module

ACER INC0 citations62

US11609048B2Mar 21, 2023

Thermal dissipation module

ACER INC0 citations62

US11402157B2Aug 2, 2022

Lattice boiler evaporator

ACER INC1 citations62

US10114434B2Oct 30, 2018

Heat dissipation module and electronic device

ACER INC1 citations52

DARFON ELECTRONICS CORP

8 patents

US10431402B2Oct 1, 2019

Button switch with adjustable tactile feedback

DARFON ELECTRONICS CORP19 citations86

US11108393B2Aug 31, 2021

Optical keyswitch triggered by support mechanism having at least one rotatable frame enable a protrusion to move along with a key cap

DARFON ELECTRONICS CORP7 citations83

US11018667B2May 25, 2021

Optical keyswitch

DARFON ELECTRONICS CORP2 citations73

US10930451B2Feb 23, 2021

Keyswitch with adjustable tactile feedback

DARFON ELECTRONICS CORP4 citations73

US10637470B2Apr 28, 2020

Optical keyswitch

DARFON ELECTRONICS CORP6 citations73

US10572018B2Feb 25, 2020

Keyswitch with adjustable tactile feedback

DARFON ELECTRONICS CORP4 citations73

US10866640B2Dec 15, 2020

Adjusting method applied to a keyswitch for adjusting tactile feedback

DARFON ELECTRONICS CORP0 citations52

US10795447B2Oct 6, 2020

Keyswitch with adjustable tactile feedback

DARFON ELECTRONICS CORP0 citations52

LIU NAI-WEI

1 patent

US8653664B2Feb 18, 2014

Barrier layers for copper interconnect

LIU NAI-WEI6 citations79

TAIWAN SEMICONDUCTOR MFG

1 patent

US8975749B2Mar 10, 2015

Method of making a semiconductor device including barrier layers for copper interconnect

TAIWAN SEMICONDUCTOR MFG5 citations73

DARFON ELECTRONICS

1 patent

US10937610B2Mar 2, 2021

Keyboard keyswitches having adjustable tactile feedback members

DARFON ELECTRONICS0 citations54

Showing the top 50 of 56 patents by PatentIndex Score.