Inventor
CHUNG HAE SUK
KR50 patents
⚠️ This page may combine multiple inventors who share the name “CHUNG HAE SUK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
39 patentsUS7630208B2Dec 8, 2009
Multilayer chip capacitor, circuit board apparatus having the capacitor, and circuit board
SAMSUNG ELECTRO MECH22 citations93
US7595973B1Sep 29, 2009
Multilayer chip capacitor and circuit board apparatus having the capacitor
SAMSUNG ELECTRO MECH26 citations93
US7092236B2Aug 15, 2006
Multilayer chip capacitor
SAMSUNG ELECTRO MECH36 citations92
US7035079B1Apr 25, 2006
Multilayered chip capacitor and multilayer chip capacitor array
SAMSUNG ELECTRO MECH34 citations92
US10347421B2Jul 9, 2019
Multilayer ceramic electronic component and method of manufacturing the same
SAMSUNG ELECTRO MECH8 citations84
US8050012B2Nov 1, 2011
Multilayer chip capacitor and circuit board device including the same
SAMSUNG ELECTRO MECH8 citations84
US7990677B2Aug 2, 2011
Multilayer chip capacitor
SAMSUNG ELECTRO MECH7 citations84
US7961453B2Jun 14, 2011
Multilayer chip capacitor
SAMSUNG ELECTRO MECH9 citations84
US7920370B2Apr 5, 2011
Multilayer chip capacitor
SAMSUNG ELECTRO MECH7 citations84
US7675733B2Mar 9, 2010
Multilayer capacitor
SAMSUNG ELECTRO MECH10 citations84
US7599166B2Oct 6, 2009
Multilayer chip capacitor
SAMSUNG ELECTRO MECH15 citations84
US7502216B2Mar 10, 2009
Multilayer chip capacitor
SAMSUNG ELECTRO MECH14 citations84
US7262952B2Aug 28, 2007
Multilayer chip capacitor
SAMSUNG ELECTRO MECH16 citations84
US7149072B2Dec 12, 2006
Multilayered chip capacitor array
SAMSUNG ELECTRO MECH14 citations83
US9758695B2Sep 12, 2017
Multilayer ceramic capacitor having a moisture resistant protective film
SAMSUNG ELECTRO MECH14 citations80
US8797709B2Aug 5, 2014
Multilayer ceramic electronic part and method of manufacturing the same
SAMSUNG ELECTRO MECH4 citations73
US9997294B2Jun 12, 2018
Electronic component and circuit board having the same
SAMSUNG ELECTRO MECH2 citations72
US8937801B2Jan 20, 2015
Array-type multilayered ceramic electronic component
SAMSUNG ELECTRO MECH2 citations63
US7974072B2Jul 5, 2011
Multilayer capacitor array
SAMSUNG ELECTRO MECH5 citations63
US7684204B2Mar 23, 2010
Circuit board for mounting multilayer chip capacitor and circuit board apparatus including the multilayer chip capacitor
SAMSUNG ELECTRO MECH5 citations63
US7679882B2Mar 16, 2010
Multilayered chip capacitor and capacitance tunning method of the same
SAMSUNG ELECTRO MECH2 citations63
US7545624B2Jun 9, 2009
Multilayer chip capacitor
SAMSUNG ELECTRO MECH5 citations63
US12362097B2Jul 15, 2025
Method of producing core-shell particles and multilayer ceramic electronic component including core-shell particles
SAMSUNG ELECTRO MECH0 citations62
US11538630B2Dec 27, 2022
Method of producing core-shell particles and multilayer ceramic electronic component including core-shell particles
SAMSUNG ELECTRO MECH0 citations62
US11469044B2Oct 11, 2022
Capacitor component
SAMSUNG ELECTRO MECH0 citations62
US9036329B2May 19, 2015
Multilayer capacitor and method of manufacturing the same
SAMSUNG ELECTRO MECH2 citations61
US11551871B2Jan 10, 2023
Dielectric composition and capacitor component using the same
SAMSUNG ELECTRO MECH0 citations59
US11227724B2Jan 18, 2022
Method of manfacturing multilayer ceramic capacitor and multilayer ceramic capacitor
SAMSUNG ELECTRO MECH0 citations59
US11017953B2May 25, 2021
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH0 citations59
US12525397B2Jan 13, 2026
Capacitor component and manufacturing method of capacitor component
SAMSUNG ELECTRO MECH0 citations57
US11618716B2Apr 4, 2023
Manufacturing method of dielectric ceramic composition and dielectric ceramic composition manufactured by the same
SAMSUNG ELECTRO MECH0 citations57
US7733628B2Jun 8, 2010
Multilayer chip capacitor
SAMSUNG ELECTRO MECH1 citations52
US10867749B2Dec 15, 2020
Multilayer capacitor
SAMSUNG ELECTRO MECH0 citations51
US10796851B2Oct 6, 2020
Capacitor component
SAMSUNG ELECTRO MECH0 citations51
US10170245B2Jan 1, 2019
Method of manufacturing multiplayer capacitor
SAMSUNG ELECTRO MECH0 citations51
US11387041B2Jul 12, 2022
Multilayer electronic component
SAMSUNG ELECTRO MECH0 citations49
US10755860B2Aug 25, 2020
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH0 citations49
US12488945B2Dec 2, 2025
Multilayer electronic component
SAMSUNG ELECTRO MECH0 citations44
US9196423B2Nov 24, 2015
Multilayer ceramic electronic part and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations42
LEE BYOUNG HWA
9 patentsUS8194389B2Jun 5, 2012
Multilayer chip capacitor including two terminals
LEE BYOUNG HWA11 citations84
US8184425B2May 22, 2012
Multilayer capacitor
LEE BYOUNG HWA12 citations84
US8159813B2Apr 17, 2012
Multilayer chip capacitor, motherboard apparatus having the same, and power distribution network
LEE BYOUNG HWA9 citations84
US8213155B2Jul 3, 2012
Multilayer chip capacitor
LEE BYOUNG HWA3 citations63
US8117584B2Feb 14, 2012
Method of implementing low ESL and controlled ESR of multilayer capacitor
LEE BYOUNG HWA2 citations63
US8081416B2Dec 20, 2011
Multilayer chip capacitor
LEE BYOUNG HWA5 citations63
US9036330B2May 19, 2015
Multilayer chip capacitor and method of fabricating the same
LEE BYOUNG HWA0 citations42
US8315034B2Nov 20, 2012
Multilayer chip capacitor with improved equivalent series resistance
LEE BYOUNG HWA0 citations42
US8233263B2Jul 31, 2012
Multilayer chip capacitor for improving ESR and ESL
LEE BYOUNG HWA0 citations42