Inventor
HIRATA AIKO
JP4 patents
Patents
4 patentsUS10090275B2Oct 2, 2018
Bonding method using bonding material
DOWA ELECTRONICS MATERIALS CO LTD0 citations48
US10008471B2Jun 26, 2018
Bonding material and bonding method using the same
DOWA ELECTRONICS MATERIALS CO LTD0 citations48
US10580910B2Mar 3, 2020
Silver-coated copper powder and method for producing same
DOWA ELECTRONICS MATERIALS CO LTD0 citations46
US11270810B2Mar 8, 2022
Electrically conductive paste
DOWA ELECTRONICS MATERIALS CO LTD0 citations45