Inventor
LIAO TSE-HSIEN
TW11 patents
Patents
11 patentsUS11612050B2Mar 21, 2023
Heat dissipation device
GIGA BYTE TECH CO LTD2 citations71
US10869384B2Dec 15, 2020
Circuit board heat dissipation assembly
GIGA BYTE TECH CO LTD3 citations71
US11812389B2Nov 7, 2023
Thermal management method for multiple heat sources and wireless communication apparatus having multiple heat sources
GIGA BYTE TECH CO LTD1 citations60
US11323141B2May 3, 2022
Control method of multi-antenna module
GIGA BYTE TECH CO LTD1 citations59
US10827645B2Nov 3, 2020
Fan expansion card and motherboard module
GIGA BYTE TECH CO LTD1 citations56
US11262914B2Mar 1, 2022
Solid-state drive and performance optimization method for solid-state drive
GIGA BYTE TECH CO LTD0 citations50
US11226863B2Jan 18, 2022
Solid-state disk and startup method
GIGA BYTE TECH CO LTD0 citations50
US11134553B2Sep 28, 2021
Lighting memory device and memory module
GIGA BYTE TECH CO LTD0 citations50
US11431078B2Aug 30, 2022
Data processing system capable of optimizing multiple antennas
GIGA BYTE TECH CO LTD0 citations48
US11157048B2Oct 26, 2021
Memory module with screen and motherboard module
GIGA BYTE TECH CO LTD0 citations44
US10645785B2May 5, 2020
Illumination dummy module
GIGA BYTE TECH CO LTD0 citations37