Inventor
SCHULTE DONALD W
US46 patents
⚠️ This page may combine multiple inventors who share the name “SCHULTE DONALD W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD DEVELOPMENT CO
32 patentsUS7490924B2Feb 17, 2009
Drop generator for ultra-small droplets
HEWLETT PACKARD DEVELOPMENT CO38 citations92
US6698868B2Mar 2, 2004
Thermal drop generator for ultra-small droplets
HEWLETT PACKARD DEVELOPMENT CO27 citations92
US6599761B2Jul 29, 2003
Monitoring and test structures for silicon etching
HEWLETT PACKARD DEVELOPMENT CO18 citations92
US6960978B2Nov 1, 2005
Fuse structure
HEWLETT PACKARD DEVELOPMENT CO23 citations90
US6627467B2Sep 30, 2003
Fluid ejection device fabrication
HEWLETT PACKARD DEVELOPMENT CO36 citations88
US6567251B1May 20, 2003
Electrostatic discharge protection of electrically-inactive components
HEWLETT PACKARD DEVELOPMENT CO15 citations84
US7125731B2Oct 24, 2006
Drop generator for ultra-small droplets
HEWLETT PACKARD DEVELOPMENT CO10 citations74
US6981759B2Jan 3, 2006
Substrate and method forming substrate for fluid ejection device
HEWLETT PACKARD DEVELOPMENT CO9 citations74
US6549690B2Apr 15, 2003
Resistor array with position dependent heat dissipation
HEWLETT PACKARD DEVELOPMENT CO6 citations74
US11667128B2Jun 6, 2023
Fluidic die with monitoring circuit fault protection structure
HEWLETT PACKARD DEVELOPMENT CO2 citations73
US7282448B2Oct 16, 2007
Substrate and method of forming substrate for fluid ejection device
HEWLETT PACKARD DEVELOPMENT CO3 citations63
US11173708B2Nov 16, 2021
Fluidic die with monitoring circuit fault protection
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US7758169B2Jul 20, 2010
Printheads and printhead cartridges using a printhead
HEWLETT PACKARD DEVELOPMENT CO2 citations62
US7550365B2Jun 23, 2009
Bonding structure and method of making
HEWLETT PACKARD DEVELOPMENT CO2 citations62
US7798611B2Sep 21, 2010
Circuit routing for printhead having increased corrosion resistance
HEWLETT PACKARD DEVELOPMENT CO2 citations61
US11225070B2Jan 18, 2022
Fluidic dies with beveled edges underneath electrical leads
HEWLETT PACKARD DEVELOPMENT CO0 citations60
US10933634B2Mar 2, 2021
Conductive wire disposed in a layer
HEWLETT PACKARD DEVELOPMENT CO1 citations59
US11214060B2Jan 4, 2022
Gaps between electrically conductive ground structures
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US10814629B2Oct 27, 2020
Termination ring with gapped metallic layer
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US6933237B2Aug 23, 2005
Substrate etch method and device
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US6711806B2Mar 30, 2004
Method of manufacturing a thermal fluid jetting apparatus
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US10675867B2Jun 9, 2020
Thermal inkjet resistor circuit
HEWLETT PACKARD DEVELOPMENT CO0 citations51
US10272671B2Apr 30, 2019
Isolating failed resistors
HEWLETT PACKARD DEVELOPMENT CO0 citations51
US7924597B2Apr 12, 2011
Data storage in circuit elements with changed resistance
HEWLETT PACKARD DEVELOPMENT CO0 citations51
US7669314B2Mar 2, 2010
Method of fabricating a fluid ejection device having a data storage structure
HEWLETT PACKARD DEVELOPMENT CO0 citations51
US7249825B2Jul 31, 2007
Fluid ejection device with data storage structure
HEWLETT PACKARD DEVELOPMENT CO1 citations51
US7083265B2Aug 1, 2006
Circuit routing for printhead having increased corrosion resistance
HEWLETT PACKARD DEVELOPMENT CO1 citations51
US10369788B2Aug 6, 2019
Printhead with recessed slot ends
HEWLETT PACKARD DEVELOPMENT CO0 citations50
US7209027B2Apr 24, 2007
Fuse structure
HEWLETT PACKARD DEVELOPMENT CO0 citations49
US7170387B2Jan 30, 2007
Fuse structure
HEWLETT PACKARD DEVELOPMENT CO0 citations49
US7679426B2Mar 16, 2010
Transistor antifuse device
HEWLETT PACKARD DEVELOPMENT CO0 citations48
US10421275B2Sep 24, 2019
Fluid ejection device
HEWLETT PACKARD DEVELOPMENT CO0 citations36
HEWLETT PACKARD CO
7 patentsUS6276775B1Aug 21, 2001
Variable drop mass inkjet drop generator
HEWLETT PACKARD CO65 citations96
US6447104B1Sep 10, 2002
Firing chamber geometry for inkjet printhead
HEWLETT PACKARD CO53 citations94
US6512284B2Jan 28, 2003
Thinfilm fuse/antifuse device and use of same in printhead
HEWLETT PACKARD CO68 citations93
US6513913B2Feb 4, 2003
Heating element of a printhead having conductive layer between resistive layers
HEWLETT PACKARD CO21 citations91
US6361150B1Mar 26, 2002
Electrostatic discharge protection of electrically-inactive components in a thermal ink jet printing system
HEWLETT PACKARD CO28 citations89
US6402283B2Jun 11, 2002
Variable drop mass inkjet drop generator
HEWLETT PACKARD CO11 citations74
US6314216B1Nov 6, 2001
Resistor array with position dependent heat dissipation
HEWLETT PACKARD CO10 citations74