Inventor

KUMAR ANANDA H

US80 patents

⚠️ This page may combine multiple inventors who share the name “KUMAR ANANDA H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KUMAR ANANDA H

APPLIED MATERIALS INC

Compliant bond structure for joining ceramic to metal

Electrostatic chuck having improved gas conduits

High density plasma process chamber

Electrostatic chuck capable of rapidly dechucking a substrate

Electrostatic chuck having composite dielectric layer and method of manufacture

Gas distribution plate electrode for a plasma reactor

Electrostatic chuck having gas cavity and method

Electrostatic chuck having heater and method

Electrostatic chuck bonded to base with a bond layer and method

Support for supporting a substrate in a process chamber

Electrostatic chuck having improved electrical connector and method

Process chamber having improved temperature control

Dielectric covered electrostatic chuck

Process chamber having a corrosion-resistant wall and method

Multi-layer ceramic electrostatic chuck with integrated channel

Electrostatic chuck with improved RF power distribution

Stand-off pad for supporting a wafer on a substrate support chuck

Multielectrode electrostatic chuck with fuses

Gas distribution plate electrode for a plasma receptor

Substrate support for plasma processing

Thermally conductive conformal media

Electrostatic chuck having a plurality of gas inlet channels

Erosion-resistant components for plasma process chambers

IBM

Interconnect structure having improved metallization

Method of making a multilayer thin film structure

Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper

Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper

Ceramic substrate having a protective coating thereon and a method for protecting a ceramic substrate

Maskless coating of metallurgical features of a dielectric substrate

Method for removal of carbonaceous residues from ceramic structures having internal metallurgy

Method for palladium activating molybdenum metallized features on a ceramic substrate

Method for repair of opens in thin film lines on a substrate

MICROFABRICA INC

Microprobe tips and methods for making

Electrochemical fabrication process for forming multilayer multimaterial microprobe structures

Method of making a contact

Microprobe tips and methods for making

Probe arrays and method for making

Microprobe tips and methods for making

UNIV SOUTHERN CALIFORNIA

Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties

Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties

Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties

Method of electrochemically fabricating multilayer structures having improved interlayer adhesion

KUMAR ANANDA H

Silicon composite substrates

Methods and structures for preparing single crystal silicon wafers for use as substrates for epitaxial growth of crack-free gallium nitride films and devices

Seal compositions, methods, and structures for planar solid oxide fuel cells

SARNOFF DAVID RES CENTER

Electrical feedthroughs for ceramic circuit board support substrates

Conductive via fill inks for ceramic multilayer circuit boards on support substrates

(unassigned)

Yttrium oxide based surface coating for semiconductor IC processing vacuum chambers

WU MING TING

Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties

COHEN ADAM L

Electrochemical fabrication process for forming multilayer multimaterial microprobe structures