Inventor
MANIWA SUSUMU
JP14 patents
⚠️ This page may combine multiple inventors who share the name “MANIWA SUSUMU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOPPAN INC
4 patentsUS12101074B2Sep 24, 2024
Multilayer circuit board with LC resonant circuit and electronic component package including multilayer circuit board with LC resonant circuit
TOPPAN INC0 citations52
US12317411B2May 27, 2025
Glass core wiring substrate incorporating high-frequency filter, high-frequency module using the same, and method of manufacturing glass core wiring substrate incorporating high-frequency filter
TOPPAN INC0 citations49
US11877394B2Jan 16, 2024
Glass core multilayer wiring board and method of producing the same
TOPPAN INC0 citations46
US12456697B2Oct 28, 2025
Multilayer wiring substrate and module having multilayer wiring substrate
TOPPAN INC0 citations44
MANIWA SUSUMU
3 patentsUS8535987B2Sep 17, 2013
Method of manufacturing substrate for semiconductor element, and semiconductor device
MANIWA SUSUMU2 citations58
US8546940B2Oct 1, 2013
Manufacturing method of lead frame substrate and semiconductor apparatus
MANIWA SUSUMU0 citations47
US8466547B2Jun 18, 2013
Method for manufacturing substrate for semiconductor element, and semiconductor device
MANIWA SUSUMU0 citations37