Inventor
KHOLODENKO ARNOLD
US53 patents
⚠️ This page may combine multiple inventors who share the name “KHOLODENKO ARNOLD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
31 patentsUS6108189AAug 22, 2000
Electrostatic chuck having improved gas conduits
APPLIED MATERIALS INC255 citations99
US6095084AAug 1, 2000
High density plasma process chamber
APPLIED MATERIALS INC250 citations99
US6721162B2Apr 13, 2004
Electrostatic chuck having composite dielectric layer and method of manufacture
APPLIED MATERIALS INC76 citations98
US6503368B1Jan 7, 2003
Substrate support having bonded sections and method
APPLIED MATERIALS INC76 citations98
US6320736B1Nov 20, 2001
Chuck having pressurized zones of heat transfer gas
APPLIED MATERIALS INC122 citations98
US6310755B1Oct 30, 2001
Electrostatic chuck having gas cavity and method
APPLIED MATERIALS INC325 citations98
US6189484B1Feb 20, 2001
Plasma reactor having a helicon wave high density plasma source
APPLIED MATERIALS INC116 citations98
US6033478AMar 7, 2000
Wafer support with improved temperature control
APPLIED MATERIALS INC94 citations98
US5900064AMay 4, 1999
Plasma process chamber
APPLIED MATERIALS INC106 citations98
US6538872B1Mar 25, 2003
Electrostatic chuck having heater and method
APPLIED MATERIALS INC123 citations97
US6490146B2Dec 3, 2002
Electrostatic chuck bonded to base with a bond layer and method
APPLIED MATERIALS INC88 citations97
US6478924B1Nov 12, 2002
Plasma chamber support having dual electrodes
APPLIED MATERIALS INC124 citations97
US6464795B1Oct 15, 2002
Substrate support member for a processing chamber
APPLIED MATERIALS INC98 citations97
US6185839B1Feb 13, 2001
Semiconductor process chamber having improved gas distributor
APPLIED MATERIALS INC83 citations97
US6094334AJul 25, 2000
Polymer chuck with heater and method of manufacture
APPLIED MATERIALS INC97 citations97
US6015465AJan 18, 2000
Temperature control system for semiconductor process chamber
APPLIED MATERIALS INC743 citations97
US6583980B1Jun 24, 2003
Substrate support tolerant to thermal expansion stresses
APPLIED MATERIALS INC60 citations96
US6462928B1Oct 8, 2002
Electrostatic chuck having improved electrical connector and method
APPLIED MATERIALS INC65 citations96
US6414834B1Jul 2, 2002
Dielectric covered electrostatic chuck
APPLIED MATERIALS INC56 citations96
US5942039AAug 24, 1999
Self-cleaning focus ring
APPLIED MATERIALS INC66 citations96
US6471822B1Oct 29, 2002
Magnetically enhanced inductively coupled plasma reactor with magnetically confined plasma
APPLIED MATERIALS INC88 citations95
US6464790B1Oct 15, 2002
Substrate support member
APPLIED MATERIALS INC126 citations95
US6151203ANov 21, 2000
Connectors for an electrostatic chuck and combination thereof
APPLIED MATERIALS INC76 citations95
US6908540B2Jun 21, 2005
Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process
APPLIED MATERIALS INC47 citations93
US6267839B1Jul 31, 2001
Electrostatic chuck with improved RF power distribution
APPLIED MATERIALS INC44 citations93
US6449871B1Sep 17, 2002
Semiconductor process chamber having improved gas distributor
APPLIED MATERIALS INC26 citations92
US5885469AMar 23, 1999
Topographical structure of an electrostatic chuck and method of fabricating same
APPLIED MATERIALS INC29 citations92
US5801915ASep 1, 1998
Electrostatic chuck having a unidirectionally conducting coupler layer
APPLIED MATERIALS INC49 citations92
US6278600B1Aug 21, 2001
Electrostatic chuck with improved temperature control and puncture resistance
APPLIED MATERIALS INC46 citations90
US5856906AJan 5, 1999
Backside gas quick dump apparatus for a semiconductor wafer processing system
APPLIED MATERIALS INC31 citations89
US6572814B2Jun 3, 2003
Method of fabricating a semiconductor wafer support chuck apparatus having small diameter gas distribution ports for distributing a heat transfer gas
APPLIED MATERIALS INC21 citations88
KHOLODENKO ARNOLD
8 patentsUS8261905B2Sep 11, 2012
Wafer carrier drive apparatus and method for operating the same
KHOLODENKO ARNOLD11 citations83
US8757177B2Jun 24, 2014
Multi-stage substrate cleaning method and apparatus
KHOLODENKO ARNOLD6 citations82
US8317934B2Nov 27, 2012
Multi-stage substrate cleaning method and apparatus
KHOLODENKO ARNOLD10 citations82
US9111968B2Aug 18, 2015
Plasma processing chamber with a grounded electrode assembly
KHOLODENKO ARNOLD11 citations77
US8584613B2Nov 19, 2013
Single substrate processing head for particle removal using low viscosity fluid
KHOLODENKO ARNOLD2 citations60
US8557051B2Oct 15, 2013
Method for using generator for foam to clean substrate
KHOLODENKO ARNOLD0 citations51
US8317966B2Nov 27, 2012
Apparatus for substantially uniform fluid flow rates relative to a proximity head in processing of a wafer surface by a meniscus
KHOLODENKO ARNOLD0 citations51
US8161984B2Apr 24, 2012
Generator for foam to clean substrate
KHOLODENKO ARNOLD1 citations51
LAM RES CORP
4 patentsUS7743730B2Jun 29, 2010
Apparatus for an optimized plasma chamber grounded electrode assembly
LAM RES CORP32 citations92
US9905402B2Feb 27, 2018
Plasma processing chamber with a grounded electrode assembly
LAM RES CORP5 citations84
US7699634B2Apr 20, 2010
High power electrical connector for a laminated heater
LAM RES CORP9 citations80
US8900400B2Dec 2, 2014
Proximity head having a fluid resistor
LAM RES CORP1 citations51
ROTOFLEX INC
2 patentsCHENG WING LAU
2 patentsO'DONNELL ROBERT
2 patents(unassigned)
1 patentShowing the top 50 of 53 patents by PatentIndex Score.