Inventor
MUTHUR SRINATH PURUSHOTHAM KAUSHIK
US14 patents
Patents
14 patentsUS9625256B1Apr 18, 2017
Device, system and method for alignment of an integrated circuit assembly
INTEL CORP3 citations71
US10361167B2Jul 23, 2019
Electronic assembly using bismuth-rich solder
INTEL CORP4 citations70
US12417958B2Sep 16, 2025
Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone
INTEL CORP0 citations59
US12347743B2Jul 1, 2025
Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone
INTEL CORP0 citations59
US12315777B2May 27, 2025
Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone
INTEL CORP0 citations59
US12406906B2Sep 2, 2025
Through mold interconnect drill feature
INTEL CORP0 citations58
US11705383B2Jul 18, 2023
Through mold interconnect drill feature
INTEL CORP0 citations58
US11551956B2Jan 10, 2023
Method and device for failure analysis using RF-based thermometry
INTEL CORP0 citations57
US12394773B2Aug 19, 2025
Laser ablation-based surface property modification and contamination removal
INTEL CORP0 citations55
US12362340B2Jul 15, 2025
Laser ablation-based surface property modification and contamination removal
INTEL CORP0 citations55
US9230833B2Jan 5, 2016
Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures
INTEL CORP0 citations51
US8999765B2Apr 7, 2015
Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures
INTEL CORP1 citations51
US11476120B2Oct 18, 2022
Method of sample preparation using dual ion beam trenching
INTEL CORP0 citations44
US10607909B2Mar 31, 2020
Systems, methods, and apparatuses for implementing a thermal solution for 3D packaging
INTEL CORP0 citations40