Inventor
GOYAL DEEPAK
US32 patents
⚠️ This page may combine multiple inventors who share the name “GOYAL DEEPAK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
21 patentsUS10935593B2Mar 2, 2021
Method of resonance analysis for electrical fault isolation
INTEL CORP21 citations90
US9625256B1Apr 18, 2017
Device, system and method for alignment of an integrated circuit assembly
INTEL CORP3 citations71
US10361167B2Jul 23, 2019
Electronic assembly using bismuth-rich solder
INTEL CORP4 citations70
US9746428B2Aug 29, 2017
Inline inspection of the contact between conductive traces and substrate for hidden defects using white light interferometer with tilted objective lens
INTEL CORP3 citations70
US9389064B2Jul 12, 2016
Inline inspection of the contact between conductive traces and substrate for hidden defects using white light interferometer with tilted objective lens
INTEL CORP4 citations69
US9508610B2Nov 29, 2016
Inline measurement of molding material thickness using terahertz reflectance
INTEL CORP5 citations68
US11346818B2May 31, 2022
Method, device and system for non-destructive detection of defects in a semiconductor die
INTEL CORP2 citations63
US12308299B2May 20, 2025
TEC-embedded dummy die to cool the bottom die edge hotspot
INTEL CORP0 citations62
US11791237B2Oct 17, 2023
Microelectronic assemblies including a thermal interface material
INTEL CORP0 citations60
US11506709B2Nov 22, 2022
X-ray filter
INTEL CORP0 citations60
US10908206B2Feb 2, 2021
Characterization of transmission media
INTEL CORP1 citations60
US7280190B1Oct 9, 2007
Electro-optic time domain reflectometry
INTEL CORP4 citations60
US11798861B2Oct 24, 2023
Integrated heat spreader (IHS) with heating element
INTEL CORP0 citations59
US11551956B2Jan 10, 2023
Method and device for failure analysis using RF-based thermometry
INTEL CORP0 citations57
US12094800B2Sep 17, 2024
Thermally conductive slugs/active dies to improve cooling of stacked bottom dies
INTEL CORP0 citations52
US9291576B2Mar 22, 2016
Detection of defect in die
INTEL CORP1 citations50
US9817028B2Nov 14, 2017
Terahertz transmission contactless probing and scanning for signal analysis and fault isolation
INTEL CORP1 citations46
US10746780B2Aug 18, 2020
High power terahertz impulse for fault isolation
INTEL CORP0 citations45
US11476120B2Oct 18, 2022
Method of sample preparation using dual ion beam trenching
INTEL CORP0 citations44
US11226353B2Jan 18, 2022
Integrated cable probe design for high bandwidth RF testing
INTEL CORP0 citations44
US10078204B2Sep 18, 2018
Non-destructive 3-dimensional chemical imaging of photo-resist material
INTEL CORP0 citations39
WALMART APOLLO LLC
3 patentsUS11281657B2Mar 22, 2022
Event-driven identity graph conflation
WALMART APOLLO LLC0 citations43
US11138077B2Oct 5, 2021
System and method for bootstrapping replicas from active partitions
WALMART APOLLO LLC0 citations41
US10936232B1Mar 2, 2021
Methods and apparatus for data repartitioning
WALMART APOLLO LLC0 citations39
CALYPTO DESIGN SYSTEMS INC
2 patentsCHAUHAN PANKAJ P
2 patentsUS8122401B1Feb 21, 2012
System, method, and computer program product for determining equivalence of netlists utilizing at least one transformation
CHAUHAN PANKAJ P8 citations80
US8117571B1Feb 14, 2012
System, method, and computer program product for determining equivalence of netlists utilizing abstractions and transformations
CHAUHAN PANKAJ P3 citations58