P

Inventor

GOYAL DEEPAK

US32 patents
⚠️ This page may combine multiple inventors who share the name “GOYAL DEEPAK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

21 patents
US10935593B2Mar 2, 2021

Method of resonance analysis for electrical fault isolation

INTEL CORP21 citations90
US9625256B1Apr 18, 2017

Device, system and method for alignment of an integrated circuit assembly

INTEL CORP3 citations71
US10361167B2Jul 23, 2019

Electronic assembly using bismuth-rich solder

INTEL CORP4 citations70
US9746428B2Aug 29, 2017

Inline inspection of the contact between conductive traces and substrate for hidden defects using white light interferometer with tilted objective lens

INTEL CORP3 citations70
US9389064B2Jul 12, 2016

Inline inspection of the contact between conductive traces and substrate for hidden defects using white light interferometer with tilted objective lens

INTEL CORP4 citations69
US9508610B2Nov 29, 2016

Inline measurement of molding material thickness using terahertz reflectance

INTEL CORP5 citations68
US11346818B2May 31, 2022

Method, device and system for non-destructive detection of defects in a semiconductor die

INTEL CORP2 citations63
US12308299B2May 20, 2025

TEC-embedded dummy die to cool the bottom die edge hotspot

INTEL CORP0 citations62
US11791237B2Oct 17, 2023

Microelectronic assemblies including a thermal interface material

INTEL CORP0 citations60
US11506709B2Nov 22, 2022

X-ray filter

INTEL CORP0 citations60
US10908206B2Feb 2, 2021

Characterization of transmission media

INTEL CORP1 citations60
US7280190B1Oct 9, 2007

Electro-optic time domain reflectometry

INTEL CORP4 citations60
US11798861B2Oct 24, 2023

Integrated heat spreader (IHS) with heating element

INTEL CORP0 citations59
US11551956B2Jan 10, 2023

Method and device for failure analysis using RF-based thermometry

INTEL CORP0 citations57
US12094800B2Sep 17, 2024

Thermally conductive slugs/active dies to improve cooling of stacked bottom dies

INTEL CORP0 citations52
US9291576B2Mar 22, 2016

Detection of defect in die

INTEL CORP1 citations50
US9817028B2Nov 14, 2017

Terahertz transmission contactless probing and scanning for signal analysis and fault isolation

INTEL CORP1 citations46
US10746780B2Aug 18, 2020

High power terahertz impulse for fault isolation

INTEL CORP0 citations45
US11476120B2Oct 18, 2022

Method of sample preparation using dual ion beam trenching

INTEL CORP0 citations44
US11226353B2Jan 18, 2022

Integrated cable probe design for high bandwidth RF testing

INTEL CORP0 citations44
US10078204B2Sep 18, 2018

Non-destructive 3-dimensional chemical imaging of photo-resist material

INTEL CORP0 citations39

WALMART APOLLO LLC

3 patents

CALYPTO DESIGN SYSTEMS INC

2 patents

CHAUHAN PANKAJ P

2 patents

IBM

1 patent

CALYPTO DESIGNS SYSTEMS

1 patent

AMAZON TECH INC

1 patent

GOOGLE LLC

1 patent