Inventor
SHIMODA SUGIROU
JP2 patents
Patents
2 patentsUS9809489B2Nov 7, 2017
Composition for forming a conductive film, a conductive film, a method for producing a plating film, a plating film, and an electronic device
JSR CORP0 citations45
US9543201B2Jan 10, 2017
Method for forming three-dimensional interconnection, circuit arrangement comprising three-dimensional interconnection, and metal film-forming composition for three-dimensional interconnection
JSR CORP0 citations33