Inventor

OJHA NIRDESH

AT2 patents

Patents

2 patents

US10967450B2Apr 6, 2021

Slicing SiC material by wire electrical discharge machining

INFINEON TECHNOLOGIES AG0 citations53

US10643860B2May 5, 2020

Methods of thinning and structuring semiconductor wafers by electrical discharge machining

INFINEON TECHNOLOGIES AG0 citations44