P

Inventor

LEE YONG DUK

KR54 patents
⚠️ This page may combine multiple inventors who share the name “LEE YONG DUK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

24 patents
US5847728ADec 8, 1998

Service station device in inkjet printer head

SAMSUNG ELECTRONICS CO LTD35 citations92
US7198419B2Apr 3, 2007

Apparatus and method of performing double-sided printing

SAMSUNG ELECTRONICS CO LTD17 citations84
US6334663B1Jan 1, 2002

Service station device for ink-jet printer

SAMSUNG ELECTRONICS CO LTD15 citations84
US5966146AOct 12, 1999

Service station having a head capping device for accurate sealing of print heads

SAMSUNG ELECTRONICS CO LTD16 citations74
US5953024ASep 14, 1999

Apparatus and method for determining initial position and protecting capping release error in inkjet printer head

SAMSUNG ELECTRONICS CO LTD15 citations72
US7559712B2Jul 14, 2009

Image forming apparatus having a guide member to guide paper

SAMSUNG ELECTRONICS CO LTD2 citations63
US7391428B2Jun 24, 2008

Thermal image forming apparatus

SAMSUNG ELECTRONICS CO LTD3 citations63
US6367998B1Apr 9, 2002

Paper jamming prevention device

SAMSUNG ELECTRONICS CO LTD2 citations63
US6325476B1Dec 4, 2001

Ink jet printer having a scan module detachably mounted thereon

SAMSUNG ELECTRONICS CO LTD4 citations63
US10998247B2May 4, 2021

Board with embedded passive component

SAMSUNG ELECTRONICS CO LTD1 citations62
US7731436B2Jun 8, 2010

Image forming apparatus with thermal printing head and printing method thereof

SAMSUNG ELECTRONICS CO LTD3 citations62
US7483046B2Jan 27, 2009

Complex image forming apparatus

SAMSUNG ELECTRONICS CO LTD4 citations62
US6764157B2Jul 20, 2004

Image forming device correcting vertical alignments and correction method thereof

SAMSUNG ELECTRONICS CO LTD4 citations62
US8371763B2Feb 12, 2013

Mobile image forming apparatus

SAMSUNG ELECTRONICS CO LTD3 citations61
US7100915B2Sep 5, 2006

Paper feeding apparatus of image forming device

SAMSUNG ELECTRONICS CO LTD4 citations61
US7367726B2May 6, 2008

Thermal image forming apparatus

SAMSUNG ELECTRONICS CO LTD3 citations60
US7417657B2Aug 26, 2008

Thermal printer and printing method

SAMSUNG ELECTRONICS CO LTD3 citations58
US7175253B2Feb 13, 2007

Maintenance apparatus used with an inkjet printer

SAMSUNG ELECTRONICS CO LTD5 citations54
US7336291B2Feb 26, 2008

Thermal image forming apparatus

SAMSUNG ELECTRONICS CO LTD1 citations52
US7300219B2Nov 27, 2007

Image forming apparatus using thermal printing head

SAMSUNG ELECTRONICS CO LTD0 citations52
US7083346B2Aug 1, 2006

Paper discharge unit for an inkjet printer

SAMSUNG ELECTRONICS CO LTD1 citations52
US7301551B2Nov 27, 2007

Thermal image forming apparatus

SAMSUNG ELECTRONICS CO LTD0 citations51
US7431520B2Oct 7, 2008

Image forming apparatus performing double-sided printing

SAMSUNG ELECTRONICS CO LTD0 citations49
US7222931B2May 29, 2007

Method and apparatus for correcting printing error

SAMSUNG ELECTRONICS CO LTD0 citations42

SAMSUNG ELECTRO MECH

20 patents
US11627659B2Apr 11, 2023

Printed circuit board and electronic package comprising the same

SAMSUNG ELECTRO MECH2 citations71
US11183462B2Nov 23, 2021

Substrate having electronic component embedded therein

SAMSUNG ELECTRO MECH2 citations69
US11539138B2Dec 27, 2022

Chip radio frequency package and radio frequency module

SAMSUNG ELECTRO MECH1 citations62
US11183765B2Nov 23, 2021

Chip radio frequency package and radio frequency module

SAMSUNG ELECTRO MECH0 citations62
US11133592B2Sep 28, 2021

Chip radio frequency package and radio frequency module

SAMSUNG ELECTRO MECH1 citations62
US12593403B2Mar 31, 2026

Printed circuit board

SAMSUNG ELECTRO MECH0 citations61
US11658417B2May 23, 2023

Antenna substrate

SAMSUNG ELECTRO MECH0 citations61
US12495496B2Dec 9, 2025

Printed circuit board

SAMSUNG ELECTRO MECH0 citations60
US11631643B2Apr 18, 2023

Substrate embedded electronic component package

SAMSUNG ELECTRO MECH0 citations60
US11587878B2Feb 21, 2023

Substrate having electronic component embedded therein

SAMSUNG ELECTRO MECH1 citations60
US11251133B2Feb 15, 2022

Substrate having electronic component embedded therein

SAMSUNG ELECTRO MECH0 citations60
US11758653B2Sep 12, 2023

Printed circuit board

SAMSUNG ELECTRO MECH0 citations59
US11382213B2Jul 5, 2022

Printed circuit board

SAMSUNG ELECTRO MECH1 citations59
US11101840B1Aug 24, 2021

Chip radio frequency package and radio frequency module

SAMSUNG ELECTRO MECH0 citations51
US11075156B2Jul 27, 2021

Substrate having electronic component embedded therein

SAMSUNG ELECTRO MECH0 citations50
US11495546B2Nov 8, 2022

Substrate having electronic component embedded therein

SAMSUNG ELECTRO MECH0 citations49
US11244905B2Feb 8, 2022

Substrate with electronic component embedded therein

SAMSUNG ELECTRO MECH0 citations49
US11640952B2May 2, 2023

Electronic component embedded substrate

SAMSUNG ELECTRO MECH0 citations48
US10779396B2Sep 15, 2020

Printed circuit board having embedded electronic device

SAMSUNG ELECTRO MECH0 citations48
US12406918B2Sep 2, 2025

Printed circuit board and electronic component package

SAMSUNG ELECTRO MECH0 citations47

LEE YONG DUK

2 patents

DS GLOBAL

2 patents

(unassigned)

1 patent

LEE YONG-DUK

1 patent

Showing the top 50 of 54 patents by PatentIndex Score.