Inventor
LEE YONG DUK
KR54 patents
⚠️ This page may combine multiple inventors who share the name “LEE YONG DUK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
24 patentsUS5847728ADec 8, 1998
Service station device in inkjet printer head
SAMSUNG ELECTRONICS CO LTD35 citations92
US7198419B2Apr 3, 2007
Apparatus and method of performing double-sided printing
SAMSUNG ELECTRONICS CO LTD17 citations84
US6334663B1Jan 1, 2002
Service station device for ink-jet printer
SAMSUNG ELECTRONICS CO LTD15 citations84
US5966146AOct 12, 1999
Service station having a head capping device for accurate sealing of print heads
SAMSUNG ELECTRONICS CO LTD16 citations74
US5953024ASep 14, 1999
Apparatus and method for determining initial position and protecting capping release error in inkjet printer head
SAMSUNG ELECTRONICS CO LTD15 citations72
US7559712B2Jul 14, 2009
Image forming apparatus having a guide member to guide paper
SAMSUNG ELECTRONICS CO LTD2 citations63
US7391428B2Jun 24, 2008
Thermal image forming apparatus
SAMSUNG ELECTRONICS CO LTD3 citations63
US6367998B1Apr 9, 2002
Paper jamming prevention device
SAMSUNG ELECTRONICS CO LTD2 citations63
US6325476B1Dec 4, 2001
Ink jet printer having a scan module detachably mounted thereon
SAMSUNG ELECTRONICS CO LTD4 citations63
US10998247B2May 4, 2021
Board with embedded passive component
SAMSUNG ELECTRONICS CO LTD1 citations62
US7731436B2Jun 8, 2010
Image forming apparatus with thermal printing head and printing method thereof
SAMSUNG ELECTRONICS CO LTD3 citations62
US7483046B2Jan 27, 2009
Complex image forming apparatus
SAMSUNG ELECTRONICS CO LTD4 citations62
US6764157B2Jul 20, 2004
Image forming device correcting vertical alignments and correction method thereof
SAMSUNG ELECTRONICS CO LTD4 citations62
US8371763B2Feb 12, 2013
Mobile image forming apparatus
SAMSUNG ELECTRONICS CO LTD3 citations61
US7100915B2Sep 5, 2006
Paper feeding apparatus of image forming device
SAMSUNG ELECTRONICS CO LTD4 citations61
US7367726B2May 6, 2008
Thermal image forming apparatus
SAMSUNG ELECTRONICS CO LTD3 citations60
US7417657B2Aug 26, 2008
Thermal printer and printing method
SAMSUNG ELECTRONICS CO LTD3 citations58
US7175253B2Feb 13, 2007
Maintenance apparatus used with an inkjet printer
SAMSUNG ELECTRONICS CO LTD5 citations54
US7336291B2Feb 26, 2008
Thermal image forming apparatus
SAMSUNG ELECTRONICS CO LTD1 citations52
US7300219B2Nov 27, 2007
Image forming apparatus using thermal printing head
SAMSUNG ELECTRONICS CO LTD0 citations52
US7083346B2Aug 1, 2006
Paper discharge unit for an inkjet printer
SAMSUNG ELECTRONICS CO LTD1 citations52
US7301551B2Nov 27, 2007
Thermal image forming apparatus
SAMSUNG ELECTRONICS CO LTD0 citations51
US7431520B2Oct 7, 2008
Image forming apparatus performing double-sided printing
SAMSUNG ELECTRONICS CO LTD0 citations49
US7222931B2May 29, 2007
Method and apparatus for correcting printing error
SAMSUNG ELECTRONICS CO LTD0 citations42
SAMSUNG ELECTRO MECH
20 patentsUS11627659B2Apr 11, 2023
Printed circuit board and electronic package comprising the same
SAMSUNG ELECTRO MECH2 citations71
US11183462B2Nov 23, 2021
Substrate having electronic component embedded therein
SAMSUNG ELECTRO MECH2 citations69
US11539138B2Dec 27, 2022
Chip radio frequency package and radio frequency module
SAMSUNG ELECTRO MECH1 citations62
US11183765B2Nov 23, 2021
Chip radio frequency package and radio frequency module
SAMSUNG ELECTRO MECH0 citations62
US11133592B2Sep 28, 2021
Chip radio frequency package and radio frequency module
SAMSUNG ELECTRO MECH1 citations62
US12593403B2Mar 31, 2026
Printed circuit board
SAMSUNG ELECTRO MECH0 citations61
US11658417B2May 23, 2023
Antenna substrate
SAMSUNG ELECTRO MECH0 citations61
US12495496B2Dec 9, 2025
Printed circuit board
SAMSUNG ELECTRO MECH0 citations60
US11631643B2Apr 18, 2023
Substrate embedded electronic component package
SAMSUNG ELECTRO MECH0 citations60
US11587878B2Feb 21, 2023
Substrate having electronic component embedded therein
SAMSUNG ELECTRO MECH1 citations60
US11251133B2Feb 15, 2022
Substrate having electronic component embedded therein
SAMSUNG ELECTRO MECH0 citations60
US11758653B2Sep 12, 2023
Printed circuit board
SAMSUNG ELECTRO MECH0 citations59
US11382213B2Jul 5, 2022
Printed circuit board
SAMSUNG ELECTRO MECH1 citations59
US11101840B1Aug 24, 2021
Chip radio frequency package and radio frequency module
SAMSUNG ELECTRO MECH0 citations51
US11075156B2Jul 27, 2021
Substrate having electronic component embedded therein
SAMSUNG ELECTRO MECH0 citations50
US11495546B2Nov 8, 2022
Substrate having electronic component embedded therein
SAMSUNG ELECTRO MECH0 citations49
US11244905B2Feb 8, 2022
Substrate with electronic component embedded therein
SAMSUNG ELECTRO MECH0 citations49
US11640952B2May 2, 2023
Electronic component embedded substrate
SAMSUNG ELECTRO MECH0 citations48
US10779396B2Sep 15, 2020
Printed circuit board having embedded electronic device
SAMSUNG ELECTRO MECH0 citations48
US12406918B2Sep 2, 2025
Printed circuit board and electronic component package
SAMSUNG ELECTRO MECH0 citations47
LEE YONG DUK
2 patentsDS GLOBAL
2 patents(unassigned)
1 patentLEE YONG-DUK
1 patentShowing the top 50 of 54 patents by PatentIndex Score.