Inventor
Chen hai-ming
TW11 patents
Patents
11 patentsUS10157871B1Dec 18, 2018
Integrated fan-out package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD20 citations94
US11127644B2Sep 21, 2021
Planarization of semiconductor packages and structures resulting therefrom
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10700031B2Jun 30, 2020
Integrated fan-out package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10522436B2Dec 31, 2019
Planarization of semiconductor packages and structures resulting therefrom
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9793242B2Oct 17, 2017
Packages with die stack including exposed molding underfill
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US9691723B2Jun 27, 2017
Connector formation methods and packaged semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US11616037B2Mar 28, 2023
Integrated fan-out package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11424199B2Aug 23, 2022
Connector formation methods and packaged semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11355461B2Jun 7, 2022
Integrated fan-out package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12412862B2Sep 9, 2025
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10522486B2Dec 31, 2019
Connector formation methods and packaged semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51