Inventor

MAHALINGAM LALGUDI M

US3 patents

⚠️ This page may combine multiple inventors who share the name “MAHALINGAM LALGUDI M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FREESCALE SEMICONDUCTOR INC

2 patents

US9111901B2Aug 18, 2015

Methods for bonding a die and a substrate

FREESCALE SEMICONDUCTOR INC0 citations49

US9105599B2Aug 11, 2015

Semiconductor devices that include a die bonded to a substrate with a gold interface layer

FREESCALE SEMICONDUCTOR INC0 citations49

JANG JIN-WOOK

1 patent

US8753983B2Jun 17, 2014

Die bonding a semiconductor device

JANG JIN-WOOK3 citations59