Inventor
OFFERMANN BERND
DE5 patents
Patents
5 patentsUS10790220B2Sep 29, 2020
Press-fit semiconductor device
NXP BV3 citations67
US9958292B1May 1, 2018
Sensor package with double-sided capacitor attach on same leads and method of fabrication
NXP BV5 citations67
US11482478B2Oct 25, 2022
Shielded electronic package and method of fabrication
NXP BV0 citations57
US10942227B2Mar 9, 2021
Dual sensor assembly and method of fabrication
NXP BV1 citations56
US11486742B2Nov 1, 2022
System with magnetic field shield structure
NXP BV0 citations42