Inventor
TSENG CHIA-YI
TW6 patents
Patents
6 patentsUS11430733B2Aug 30, 2022
Method of testing wafer
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US10818595B2Oct 27, 2020
Semiconductor structure, testing and fabricating methods thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations71
US12009302B2Jun 11, 2024
Method of testing wafer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10672777B2Jun 2, 2020
Method of manufacturing semiconductor device having multi-height structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10211214B2Feb 19, 2019
Semiconductor device having milti-height structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10037927B2Jul 31, 2018
Semiconductor structure, testing and fabricating method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50