Inventor

KATO HIROTAKA

JP27 patents

⚠️ This page may combine multiple inventors who share the name “KATO HIROTAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KATO HIROTAKA

AUTONETWORKS TECHNOLOGIES LTD

Wire harness routing device

Fixing structure of wiring member and wiring member

Fixing structure of wiring member, and wiring member with joint member

Wiring harness unit and wiring harness mounting structure

Fixing structure of wiring member, and wiring member with heat generation layer

Wire harness and wire harness routing apparatus

Wire harness routing apparatus

KOMATSU DENSHI KINZOKU KK

Method of fabricating direct-bonded semiconductor wafers

Jig for peeling a bonded wafer

Silicon-on-insulator substrate and a method for fabricating the same

Method of measuring a Fe-B concentration of a silicon wafer

Method of processing a surface of a semiconductor substrate

TOYOTA BOSHOKU KK

Vehicle seat

Vehicle seat

SUMCO TECHXIV CORP

Method of manufacturing epitaxial silicon wafer and apparatus therefor

Method of manufacturing epitaxial silicon wafer

SUMITOMO ELECTRIC INDUSTRIES

Multicore cable

Multicore cable

TOYOTA MOTOR CO LTD

Travel controller and method for travel control

Route selection device and method

TOKYO BIJUTSU SHIKOU JIGYOU KY

Book-like disc casing

KOMATSU MFG CO LTD

Sinter joining method and sintered composite member produced by same

AISAN IND

Commutateur of improved segment joinability

KOMATSU ELECTRONIC METALS INC

Method of evaluating a density of oxygen-precipitation defects in a silicon wafer

KAWASAKI MOTORS LTD

Screen for saddle-riding vehicle

SUMCO CORP

Semiconductor wafer evaluation method and semiconductor wafer manufacturing method

NARAHARA KAZUHIRO

Method of manufacturing epitaxial silicon wafer and apparatus therefor