Inventor

MATSUNAGA HIROTAKA

JP21 patents

⚠️ This page may combine multiple inventors who share the name “MATSUNAGA HIROTAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MATSUNAGA HIROTAKA

MITSUBISHI MATERIALS CORP

Copper alloy, copper alloy plastic-processed material, component for electronic and electric devices, terminal, bus bar, and heat-diffusing substrate

Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar

Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar

Copper alloy for electronic/electrical device, plastically-worked copper alloy material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar

Pure copper plate, copper/ceramic bonded body, and insulated circuit board

Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relay

Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relay

Slit copper material, part for electric/electronic device, bus bar, heat dissipation substrate

Copper alloy for electronic/electric device, copper alloy sheet/strip material for electronic/electric device, component for electronic/electric device, terminal, and busbar

Pure copper plate

Copper alloy for electronic/electrical devices, copper alloy planar bar stock for electronic/electrical devices, component for electronic/electrical devices, terminal and bus bar

Copper alloy, plastically worked copper alloy material, component for electronic/electrical equipment, terminal, heat dissipation substrate

Copper alloy, copper alloy plastic working material, component for electronic/electrical device, terminal, bus bar, lead frame, and heat dissipation substrate

Copper alloy for electronic/electric device, copper alloy sheet/strip material for electronic/electric device, component for electronic/electric device, terminal, and busbar

Copper alloy for electric and electronic devices, copper alloy sheet for electric and electronic devices, component for electric and electronic devices, terminal, and bus bar

SEIKO EPSON CORP

Image formation apparatus and image formation method

Recording device and recording method

Printing apparatus and printing method

Printing control device and printing control method

MATSUNAGA HIROTAKA

Printing apparatus and printing method

Devices and methods for printing background images