Inventor

TOMINAGA RYOJIRO

JP27 patents

⚠️ This page may combine multiple inventors who share the name “TOMINAGA RYOJIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TOMINAGA RYOJIRO

FUJI CORP

Circuit formation method

Circuit forming method

Method for manufacturing stack components

Wiring formation method

Printed substrate forming method

Three-dimensional multi-layer electronic device production method

Three-dimensional molding machine

Cured resin formation method and cured resin formation device

Production method and production device for three-dimensionally fabricated object

Image processing device, image processing method, and computer readable medium that process an image in which a wiring pattern is drawn and outputs the image as raster data

Shaping method and shaping device

Method for manufacturing circuit wiring by three-dimensional additive manufacturing

Electronic circuit production method using 3D layer shaping

IBIDEN CO LTD

Wiring board with cavity for built-in electronic component and method for manufacturing the same

Wiring board with built-in electronic component and method for manufacturing the same

Wiring substrate and method for manufacturing the same

Printed wiring board and method for manufacturing the same

Method for manufacturing a wiring board

Wiring board and method for manufacturing wiring board

ISHIDA ATSUSHI

Wiring board and method for manufacturing the same

Wiring board and method for manufacturing the same

Wiring board and method for manufacturing the same

NIKI AYAO

Method for manufacturing substrate with metal film

Substrate with metal film and method for manufacturing the same

MORITA HARUHIKO

Wiring board and method for manufacturing the same

NISHIOKA HIROYUKI

Printed wiring board and method for manufacturing printed wiring board

TOMINAGA RYOJIRO

Printed wiring board and method for manufacturing printed wiring board