P

Inventor

GOLONZKA OLEG

US83 patents
⚠️ This page may combine multiple inventors who share the name “GOLONZKA OLEG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

45 patents
US10297549B2May 21, 2019

Method of forming stacked trench contacts and structures formed thereby

INTEL CORP5 citations84
US9922930B2Mar 20, 2018

Method of forming stacked trench contacts and structures formed thereby

INTEL CORP5 citations84
US9559060B2Jan 31, 2017

Method of forming stacked trench contacts and structures formed thereby

INTEL CORP5 citations84
US9437546B2Sep 6, 2016

Method of forming stacked trench contacts and structures formed thereby

INTEL CORP5 citations84
US9252267B2Feb 2, 2016

Method of forming stacked trench contacts and structures formed thereby

INTEL CORP5 citations84
US7768074B2Aug 3, 2010

Dual salicide integration for salicide through trench contacts and structures formed thereby

INTEL CORP13 citations84
US10409152B2Sep 10, 2019

Pattern decomposition lithography techniques

INTEL CORP4 citations83
US11018222B1May 25, 2021

Metallization in integrated circuit structures

INTEL CORP16 citations82
US7314836B2Jan 1, 2008

Enhanced nitride layers for metal oxide semiconductors

INTEL CORP12 citations79
US12272737B2Apr 8, 2025

Gate-all-around integrated circuit structures having adjacent structures for sub-fin electrical contact

INTEL CORP2 citations75
US11799009B2Oct 24, 2023

Gate-all-around integrated circuit structures having adjacent structures for sub-fin electrical contact

INTEL CORP4 citations75
US11908856B2Feb 20, 2024

Gate-all-around integrated circuit structures having devices with source/drain-to-substrate electrical contact

INTEL CORP5 citations73
US11824116B2Nov 21, 2023

Gate-all-around integrated circuit structures having devices with channel-to-substrate electrical contact

INTEL CORP4 citations73
US11721630B2Aug 8, 2023

Method of forming stacked trench contacts and structures formed thereby

INTEL CORP2 citations73
US10811595B2Oct 20, 2020

Techniques for forming logic including integrated spin-transfer torque magnetoresistive random-access memory

INTEL CORP2 citations73
US10411068B2Sep 10, 2019

Electrical contacts for magnetoresistive random access memory devices

INTEL CORP3 citations73
US10340445B2Jul 2, 2019

PSTTM device with bottom electrode interface material

INTEL CORP5 citations73
US10326075B2Jun 18, 2019

PSTTM device with multi-layered filter stack

INTEL CORP2 citations73
US11404630B2Aug 2, 2022

Perpendicular spin transfer torque memory (pSTTM) devices with enhanced stability and method to form same

INTEL CORP2 citations72
US11107786B2Aug 31, 2021

Pattern decomposition lithography techniques

INTEL CORP2 citations72
US10861851B2Dec 8, 2020

Wrap-around trench contact structure and methods of fabrication

INTEL CORP1 citations72
US10490519B2Nov 26, 2019

Pattern decomposition lithography techniques

INTEL CORP2 citations72
US10559744B2Feb 11, 2020

Texture breaking layer to decouple bottom electrode from PMTJ device

INTEL CORP2 citations71
US12364002B2Jul 15, 2025

Integrated circuit structures having metal gates with tapered plugs

INTEL CORP2 citations69
US11063088B2Jul 13, 2021

Magnetic memory devices and methods of fabrication

INTEL CORP3 citations69
US11342499B2May 24, 2022

RRAM devices with reduced forming voltage

INTEL CORP4 citations68
US9318694B2Apr 19, 2016

Methods of forming a magnetic random access memory etch spacer and structures formed thereby

INTEL CORP4 citations67
US12142566B2Nov 12, 2024

Method of forming stacked trench contacts and structures formed thereby

INTEL CORP0 citations63
US12033894B2Jul 9, 2024

Gate aligned contact and method to fabricate same

INTEL CORP0 citations63
US11756829B2Sep 12, 2023

Gate aligned contact and method to fabricate same

INTEL CORP0 citations63
US11495496B2Nov 8, 2022

Gate aligned contact and method to fabricate same

INTEL CORP0 citations63
US11335639B2May 17, 2022

Method of forming stacked trench contacts and structures formed thereby

INTEL CORP0 citations63
US10910265B2Feb 2, 2021

Gate aligned contact and method to fabricate same

INTEL CORP0 citations63
US12426360B2Sep 23, 2025

Wrap-around trench contact structure and methods of fabrication

INTEL CORP0 citations62
US12295170B2May 6, 2025

Fabrication of gate-all-around integrated circuit structures having additive metal gates and gate dielectrics with a dipole layer

INTEL CORP1 citations62
US11776959B2Oct 3, 2023

Wrap-around trench contact structure and methods of fabrication

INTEL CORP0 citations62
US10868233B2Dec 15, 2020

Approaches for strain engineering of perpendicular magnetic tunnel junctions (pMTJs) and the resulting structures

INTEL CORP1 citations62
US10418415B2Sep 17, 2019

Interconnect capping process for integration of MRAM devices and the resulting structures

INTEL CORP1 citations62
US12402349B2Aug 26, 2025

Gate-all-around integrated circuit structures having devices with channel-to-substrate electrical contact

INTEL CORP0 citations61
US12288789B2Apr 29, 2025

Gate-all-around integrated circuit structures having devices with source/drain-to-substrate electrical contact

INTEL CORP0 citations61
US12278204B2Apr 15, 2025

Pattern decomposition lithography techniques

INTEL CORP0 citations61
US11837641B2Dec 5, 2023

Gate-all-around integrated circuit structures having adjacent deep via substrate contacts for sub-fin electrical contact

INTEL CORP0 citations61
US11770979B2Sep 26, 2023

Conductive alloy layer in magnetic memory devices and methods of fabrication

INTEL CORP0 citations61
US11737368B2Aug 22, 2023

Magnetic memory devices and methods of fabrication

INTEL CORP0 citations61
US11502254B2Nov 15, 2022

Resistive random access memory device and methods of fabrication

INTEL CORP1 citations61

GOLONZKA OLEG

2 patents

SELL BERNHARD

1 patent

STEIGERWALD JOSEPH

1 patent

WALLACE CHARLES H

1 patent

Showing the top 50 of 83 patents by PatentIndex Score.