Inventor
GOLONZKA OLEG
US83 patents
⚠️ This page may combine multiple inventors who share the name “GOLONZKA OLEG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
45 patentsUS10297549B2May 21, 2019
Method of forming stacked trench contacts and structures formed thereby
INTEL CORP5 citations84
US9922930B2Mar 20, 2018
Method of forming stacked trench contacts and structures formed thereby
INTEL CORP5 citations84
US9559060B2Jan 31, 2017
Method of forming stacked trench contacts and structures formed thereby
INTEL CORP5 citations84
US9437546B2Sep 6, 2016
Method of forming stacked trench contacts and structures formed thereby
INTEL CORP5 citations84
US9252267B2Feb 2, 2016
Method of forming stacked trench contacts and structures formed thereby
INTEL CORP5 citations84
US7768074B2Aug 3, 2010
Dual salicide integration for salicide through trench contacts and structures formed thereby
INTEL CORP13 citations84
US10409152B2Sep 10, 2019
Pattern decomposition lithography techniques
INTEL CORP4 citations83
US11018222B1May 25, 2021
Metallization in integrated circuit structures
INTEL CORP16 citations82
US7314836B2Jan 1, 2008
Enhanced nitride layers for metal oxide semiconductors
INTEL CORP12 citations79
US12272737B2Apr 8, 2025
Gate-all-around integrated circuit structures having adjacent structures for sub-fin electrical contact
INTEL CORP2 citations75
US11799009B2Oct 24, 2023
Gate-all-around integrated circuit structures having adjacent structures for sub-fin electrical contact
INTEL CORP4 citations75
US11908856B2Feb 20, 2024
Gate-all-around integrated circuit structures having devices with source/drain-to-substrate electrical contact
INTEL CORP5 citations73
US11824116B2Nov 21, 2023
Gate-all-around integrated circuit structures having devices with channel-to-substrate electrical contact
INTEL CORP4 citations73
US11721630B2Aug 8, 2023
Method of forming stacked trench contacts and structures formed thereby
INTEL CORP2 citations73
US10811595B2Oct 20, 2020
Techniques for forming logic including integrated spin-transfer torque magnetoresistive random-access memory
INTEL CORP2 citations73
US10411068B2Sep 10, 2019
Electrical contacts for magnetoresistive random access memory devices
INTEL CORP3 citations73
US10340445B2Jul 2, 2019
PSTTM device with bottom electrode interface material
INTEL CORP5 citations73
US10326075B2Jun 18, 2019
PSTTM device with multi-layered filter stack
INTEL CORP2 citations73
US11404630B2Aug 2, 2022
Perpendicular spin transfer torque memory (pSTTM) devices with enhanced stability and method to form same
INTEL CORP2 citations72
US11107786B2Aug 31, 2021
Pattern decomposition lithography techniques
INTEL CORP2 citations72
US10861851B2Dec 8, 2020
Wrap-around trench contact structure and methods of fabrication
INTEL CORP1 citations72
US10490519B2Nov 26, 2019
Pattern decomposition lithography techniques
INTEL CORP2 citations72
US10559744B2Feb 11, 2020
Texture breaking layer to decouple bottom electrode from PMTJ device
INTEL CORP2 citations71
US12364002B2Jul 15, 2025
Integrated circuit structures having metal gates with tapered plugs
INTEL CORP2 citations69
US11063088B2Jul 13, 2021
Magnetic memory devices and methods of fabrication
INTEL CORP3 citations69
US11342499B2May 24, 2022
RRAM devices with reduced forming voltage
INTEL CORP4 citations68
US9318694B2Apr 19, 2016
Methods of forming a magnetic random access memory etch spacer and structures formed thereby
INTEL CORP4 citations67
US12142566B2Nov 12, 2024
Method of forming stacked trench contacts and structures formed thereby
INTEL CORP0 citations63
US12033894B2Jul 9, 2024
Gate aligned contact and method to fabricate same
INTEL CORP0 citations63
US11756829B2Sep 12, 2023
Gate aligned contact and method to fabricate same
INTEL CORP0 citations63
US11495496B2Nov 8, 2022
Gate aligned contact and method to fabricate same
INTEL CORP0 citations63
US11335639B2May 17, 2022
Method of forming stacked trench contacts and structures formed thereby
INTEL CORP0 citations63
US10910265B2Feb 2, 2021
Gate aligned contact and method to fabricate same
INTEL CORP0 citations63
US12426360B2Sep 23, 2025
Wrap-around trench contact structure and methods of fabrication
INTEL CORP0 citations62
US12295170B2May 6, 2025
Fabrication of gate-all-around integrated circuit structures having additive metal gates and gate dielectrics with a dipole layer
INTEL CORP1 citations62
US11776959B2Oct 3, 2023
Wrap-around trench contact structure and methods of fabrication
INTEL CORP0 citations62
US10868233B2Dec 15, 2020
Approaches for strain engineering of perpendicular magnetic tunnel junctions (pMTJs) and the resulting structures
INTEL CORP1 citations62
US10418415B2Sep 17, 2019
Interconnect capping process for integration of MRAM devices and the resulting structures
INTEL CORP1 citations62
US12402349B2Aug 26, 2025
Gate-all-around integrated circuit structures having devices with channel-to-substrate electrical contact
INTEL CORP0 citations61
US12288789B2Apr 29, 2025
Gate-all-around integrated circuit structures having devices with source/drain-to-substrate electrical contact
INTEL CORP0 citations61
US12278204B2Apr 15, 2025
Pattern decomposition lithography techniques
INTEL CORP0 citations61
US11837641B2Dec 5, 2023
Gate-all-around integrated circuit structures having adjacent deep via substrate contacts for sub-fin electrical contact
INTEL CORP0 citations61
US11770979B2Sep 26, 2023
Conductive alloy layer in magnetic memory devices and methods of fabrication
INTEL CORP0 citations61
US11737368B2Aug 22, 2023
Magnetic memory devices and methods of fabrication
INTEL CORP0 citations61
US11502254B2Nov 15, 2022
Resistive random access memory device and methods of fabrication
INTEL CORP1 citations61
GOLONZKA OLEG
2 patentsSELL BERNHARD
1 patentSTEIGERWALD JOSEPH
1 patentWALLACE CHARLES H
1 patentShowing the top 50 of 83 patents by PatentIndex Score.