Inventor

AOKI HIDEO

JP117 patents

⚠️ This page may combine multiple inventors who share the name “AOKI HIDEO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

AOKI HIDEO

HITACHI LTD

Congestion control and avoidance method in a data processing system

Process for producing semiconductor integrated circuit device

Semiconductor integrated circuit device in which a conductive film is formed over a trap film which in turn is formed over a titanium film

Method of manufacturing a semiconductor device

Semiconductor integrated circuit device, and method of manufacturing the same

Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same

Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same

Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same

Method for forming semiconductor integrated circuit device having a capacitor

Semiconductor integrated circuit and method of manufacturing same

Congestion control and avoidance method in a data processing system

Data communication system using priority queues with wait count information for determining whether to provide services to client requests

Method for fabricating semiconductor integrated circuit

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor integrated circuit device having a capacitor

Semiconductor integrated circuit device and process for manufacturing the same

Semiconductor integrated circuit device including a memory device having memory cells with increased information storage capacitance

Method of manufacturing semiconductor device with increased focus margin

Method for fabricating semiconductor integrated circuit

Semiconductor integrated circuit device having a first wiring strip exposed through a connecting hole, a transition-metal film in the connecting hole and an aluminum wiring strip thereover, and a transition-metal nitride film between the aluminum wiring strip and the transition-metal film

Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same

Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same

Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same

Method of forming teos oxide and silicon nitride passivation layer on aluminum wiring

Semiconductor integrated circuit device process for fabricating the same and apparatus for fabricating the same

TOSHIBA KK

Semiconductor package integral with semiconductor chip

Semiconductor package and fabrication method

Production of semiconductor package having semiconductor chip mounted with its face down on substrate with protruded electrodes therebetween and semiconductor package

Methods of fabricating of semiconductor package and mounting of semiconductor device

Method for connecting electronic device

Semiconductor device with cooling member

Semiconductor device

RICOH KK

Compact front-operable image forming apparatus

Image forming apparatus using a photosensitive drum selectively pivoting with an upper part of the housing

Electrostatic recording apparatus

Image forming apparatus having a used toner storage portion

Toner contamination preventive means

Belt conveyance apparatus and image forming apparatus using such a belt conveyance apparatus

RENESAS TECH CORP

Semiconductor integrated circuit device

Semiconductor integrated circuit device

Semiconductor integrated circuit device

Method of forming semiconductor device including silicon oxide with fluorine, embedded wiring layer, via holes, and wiring grooves

MITSUBISHI RAYON CO

Thermoplastic resin composition and molded article comprising the same

Thermoplastic resin composition and production method thereof

KATSUYAMA GORO

Compact front-operable image forming apparatus

Compact front-operable image forming apparatus

(unassigned)

Semiconductor integrated circuit device and method of manufacturing the same

TAMURA SEISAKUSHO KK

Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus

TEXAS INSTRUMENTS INC

Method of forming a semiconductor device have a screen stacked cell capacitor

NIPPON MINING CO

Method for removal of mercury in sulfur dioxide-containing gas