Inventor

YAGI HARUMI

JP3 patents

⚠️ This page may combine multiple inventors who share the name “YAGI HARUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FUJITSU LTD

2 patents

US6109507AAug 29, 2000

Method of forming solder bumps and method of forming preformed solder bumps

FUJITSU LTD88 citations95

US4691855ASep 8, 1987

Twin wire splitter system

FUJITSU LTD3 citations56

YAMAMOTO TSUYOSHI

1 patent

US9117788B2Aug 25, 2015

Heat sink device and method of repairing semiconductor device

YAMAMOTO TSUYOSHI0 citations49