P

Inventor

KIM JEONG RYEOL

KR44 patents
⚠️ This page may combine multiple inventors who share the name “KIM JEONG RYEOL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

40 patents
US11694844B2Jul 4, 2023

Multilayer electronic component

SAMSUNG ELECTRO MECH4 citations74
US12068110B2Aug 20, 2024

Multilayer electronic component

SAMSUNG ELECTRO MECH1 citations73
US11901131B2Feb 13, 2024

Multilayer ceramic electronic component including external electrodes having improved reliability

SAMSUNG ELECTRO MECH2 citations73
US11211202B2Dec 28, 2021

Multilayer ceramic electronic component and method of manufacturing the same

SAMSUNG ELECTRO MECH2 citations73
US11315729B2Apr 26, 2022

Multilayer ceramic capacitor

SAMSUNG ELECTRO MECH2 citations72
US10714262B2Jul 14, 2020

Multilayer capacitor

SAMSUNG ELECTRO MECH2 citations72
US11152153B2Oct 19, 2021

Multilayer ceramic electronic component with internal electrode including nickel powder and copper coating layer and method of manufacturing the same

SAMSUNG ELECTRO MECH2 citations71
US11031185B2Jun 8, 2021

Electronic component

SAMSUNG ELECTRO MECH3 citations71
US10892093B2Jan 12, 2021

Multilayer capacitor

SAMSUNG ELECTRO MECH2 citations69
US12224124B2Feb 11, 2025

Multilayer electronic component

SAMSUNG ELECTRO MECH1 citations63
US12592340B2Mar 31, 2026

Multilayer electronic component

SAMSUNG ELECTRO MECH0 citations62
US12278052B2Apr 15, 2025

Multilayer electronic component

SAMSUNG ELECTRO MECH0 citations62
US12266476B2Apr 1, 2025

Multilayer ceramic electronic component

SAMSUNG ELECTRO MECH0 citations62
US11869720B2Jan 9, 2024

Dielectric composition and multilayer electronic component including the same

SAMSUNG ELECTRO MECH0 citations62
US11715596B2Aug 1, 2023

Multilayer ceramic capacitor

SAMSUNG ELECTRO MECH0 citations62
US11594374B2Feb 28, 2023

Multilayer ceramic electronic component

SAMSUNG ELECTRO MECH0 citations62
US11551874B2Jan 10, 2023

Multilayer ceramic electronic component and method of manufacturing the same

SAMSUNG ELECTRO MECH0 citations62
US11348729B2May 31, 2022

Dielectric composition and multilayer electronic component including the same

SAMSUNG ELECTRO MECH0 citations62
US10840017B2Nov 17, 2020

Multilayer ceramic electronic component having improved internal electrode, and method of manufacturing the same

SAMSUNG ELECTRO MECH1 citations62
US9202629B2Dec 1, 2015

Multilayer ceramic electronic component

SAMSUNG ELECTRO MECH3 citations62
US12154721B2Nov 26, 2024

Multilayer electronic component, and method of manufacturing the same

SAMSUNG ELECTRO MECH0 citations61
US11990280B2May 21, 2024

Capacitor component having nickel and carbon between internal electrode and dielectric layers

SAMSUNG ELECTRO MECH0 citations61
US11894189B2Feb 6, 2024

Capacitor component and method of manufacturing the same

SAMSUNG ELECTRO MECH1 citations61
US11862403B2Jan 2, 2024

Method of manufacturing multilayer ceramic capacitor and multilayer ceramic capacitor

SAMSUNG ELECTRO MECH0 citations61
US9218909B2Dec 22, 2015

Multi-layered ceramic electronic component

SAMSUNG ELECTRO MECH2 citations61
US12322549B2Jun 3, 2025

Capacitor component and paste for external electrode

SAMSUNG ELECTRO MECH0 citations60
US12106905B2Oct 1, 2024

Ceramic electronic component including bonding layer between body and sintered external electrode

SAMSUNG ELECTRO MECH0 citations60
US11990279B2May 21, 2024

Capacitor component and paste for external electrode

SAMSUNG ELECTRO MECH1 citations60
US11651901B2May 16, 2023

Multilayer electronic component

SAMSUNG ELECTRO MECH0 citations60
US11694846B2Jul 4, 2023

Multilayer ceramic electronic component

SAMSUNG ELECTRO MECH0 citations59
US12518929B2Jan 6, 2026

Multilayer ceramic capacitor and method of preparing the same

SAMSUNG ELECTRO MECH0 citations56
US12191080B2Jan 7, 2025

Multilayer ceramic electronic component

SAMSUNG ELECTRO MECH0 citations54
US11705283B2Jul 18, 2023

Multilayer ceramic electronic component

SAMSUNG ELECTRO MECH0 citations52
US8936737B2Jan 20, 2015

Conductive paste for internal electrodes, multilayer ceramic electronic component using the same, and method of manufacturing the same

SAMSUNG ELECTRO MECH1 citations52
US11469051B2Oct 11, 2022

Multilayer capacitor and board having the same mounted thereon

SAMSUNG ELECTRO MECH0 citations51
US12444539B2Oct 14, 2025

Method for fabricating multilayer ceramic electronic component

SAMSUNG ELECTRO MECH0 citations50
US10305018B2May 28, 2019

Manufacturing method of electronic component

SAMSUNG ELECTRO MECH0 citations50
US9251925B2Feb 2, 2016

Conductive paste for external electrodes and multilayer ceramic electronic component using the same

SAMSUNG ELECTRO MECH0 citations50
US10872728B2Dec 22, 2020

Multilayer ceramic electronic component and method of manufacturing the same

SAMSUNG ELECTRO MECH0 citations48
US11574774B2Feb 7, 2023

Multilayer electronic component and method of manufacturing the same

SAMSUNG ELECTRO MECH0 citations41

KIM JEONG-RYEOL

2 patents

HONG KUG SUN

1 patent

SEOUL NAT UNIV IND FOUNDATION

1 patent