Inventor
CHO HYUNCHUL
KR9 patents
⚠️ This page may combine multiple inventors who share the name “CHO HYUNCHUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QUALCOMM INC
5 patentsUS12125742B2Oct 22, 2024
Package comprising a substrate with high density interconnects
QUALCOMM INC2 citations71
US12126071B2Oct 22, 2024
Multi-directional antenna modules employing a surface-mount antenna(s) to support antenna pattern multi-directionality, and related fabrication methods
QUALCOMM INC1 citations61
US11869833B2Jan 9, 2024
Package comprising a substrate with a via interconnect coupled to a trace interconnect and method of fabricating the same
QUALCOMM INC0 citations61
US11439008B2Sep 6, 2022
Package with substrate comprising variable thickness solder resist layer
QUALCOMM INC1 citations57
US12593705B2Mar 31, 2026
Hybrid core substrate with embedded components
QUALCOMM INC0 citations46