Inventor
BANDO TSUBASA
JP4 patents
Patents
4 patentsUS12068165B2Aug 20, 2024
Method for manufacturing semiconductor device and apparatus for manufacturing semiconductor device
OKAMOTO MACHINE TOOL WORKS2 citations69
US11745299B2Sep 5, 2023
Grinding method of composite substrate including resin and grinding apparatus thereof
OKAMOTO MACHINE TOOL WORKS0 citations59
US12358095B2Jul 15, 2025
Substrate grinding device and substrate grinding method
OKAMOTO MACHINE TOOL WORKS0 citations48
US11735411B2Aug 22, 2023
Method and apparatus for manufacturing semiconductor device
OKAMOTO MACHINE TOOL WORKS0 citations48