P

Inventor

ANDERSON BRENT

US81 patents
⚠️ This page may combine multiple inventors who share the name “ANDERSON BRENT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

22 patents
US10811528B2Oct 20, 2020

Two step fin etch and reveal for VTFETs and high breakdown LDVTFETs

IBM7 citations83
US12057371B2Aug 6, 2024

Semiconductor device with early buried power rail (BPR) and backside power distribution network (BSPDN)

IBM5 citations75
US11894265B2Feb 6, 2024

Top via with damascene line and via

IBM2 citations73
US11658116B2May 23, 2023

Interconnects on multiple sides of a semiconductor structure

IBM2 citations73
US11276639B2Mar 15, 2022

Conductive lines with subtractive cuts

IBM3 citations73
US11195795B1Dec 7, 2021

Well-controlled edge-to-edge spacing between adjacent interconnects

IBM3 citations73
US11189568B2Nov 30, 2021

Top via interconnect having a line with a reduced bottom dimension

IBM2 citations73
US11171084B2Nov 9, 2021

Top via with next level line selective growth

IBM2 citations73
US12142525B2Nov 12, 2024

Self-aligning spacer tight pitch via

IBM0 citations63
US12136655B2Nov 5, 2024

Backside electrical contacts to buried power rails

IBM0 citations63
US11990410B2May 21, 2024

Top via interconnect having a line with a reduced bottom dimension

IBM0 citations63
US11915966B2Feb 27, 2024

Backside power rail integration

IBM0 citations63
US11901440B2Feb 13, 2024

Sacrificial fin for self-aligned contact rail formation

IBM0 citations63
US11855191B2Dec 26, 2023

Vertical FET with contact to gate above active fin

IBM0 citations63
US11842961B2Dec 12, 2023

Advanced metal interconnects with a replacement metal

IBM0 citations63
US11830774B2Nov 28, 2023

Buried contact through fin-to-fin space for vertical transport field effect transistor

IBM0 citations63
US11823998B2Nov 21, 2023

Top via with next level line selective growth

IBM0 citations63
US11804406B2Oct 31, 2023

Top via cut fill process for line extension reduction

IBM0 citations63
US11791258B2Oct 17, 2023

Conductive lines with subtractive cuts

IBM0 citations63
US11764298B2Sep 19, 2023

VTFET with buried power rails

IBM0 citations63
US11563003B2Jan 24, 2023

Fin top hard mask formation after wafer flipping process

IBM1 citations63
US11538939B2Dec 27, 2022

Controlled bottom junctions

IBM0 citations63

CTI IND CORP

7 patents

BRIGHTZ LTD

6 patents

MARS INC

4 patents

GLOBALFOUNDRIES INC

3 patents

ANDERSON BRENT

3 patents

CTI IND INC

2 patents

EVEREST MEDICAL CORP

1 patent

KRUMHOLZ LYNN

1 patent

CALLAWAY GOLF CO

1 patent

Showing the top 50 of 81 patents by PatentIndex Score.