Inventor
CHENG YUNG-SHIH
TW13 patents
⚠️ This page may combine multiple inventors who share the name “CHENG YUNG-SHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
11 patentsUS11764143B2Sep 19, 2023
Increasing contact areas of contacts for MIM capacitors
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12543566B2Feb 3, 2026
Semiconductor devices and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12538794B2Jan 27, 2026
Increasing contact areas of contacts for MIM capacitors
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12165947B2Dec 10, 2024
Semiconductor devices and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11923295B2Mar 5, 2024
Interconnect level with high resistance layer and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12074107B2Aug 27, 2024
Structure and method of forming a semiconductor device with resistive elements
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11908829B2Feb 20, 2024
Integrated circuit package and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11437313B2Sep 6, 2022
Structure and method of forming a semiconductor device with resistive elements
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12230603B2Feb 18, 2025
Method of fabricating a semiconductor chip having strength adjustment pattern in bonding layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12142574B2Nov 12, 2024
Semiconductor devices and methods of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11756924B2Sep 12, 2023
Method of fabricating a semiconductor chip having strength adjustment pattern in bonding layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59