Inventor
SINGH KULJEET
IN9 patents
⚠️ This page may combine multiple inventors who share the name “SINGH KULJEET”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
8 patentsUS7247517B2Jul 24, 2007
Method and apparatus for a dual substrate package
INTEL CORP37 citations92
US6764877B2Jul 20, 2004
Method of dissipating static electric charge from a chip assembly during a manufacturing operation
INTEL CORP13 citations82
US6715663B2Apr 6, 2004
Wire-bond process flow for copper metal-six, structures achieved thereby, and testing method
INTEL CORP11 citations73
US6404067B1Jun 11, 2002
Plastic ball grid array package with improved moisture resistance
INTEL CORP12 citations72
US6566741B2May 20, 2003
Grounding of package substrates
INTEL CORP12 citations71
US7064431B2Jun 20, 2006
Electronic assembly having select spacing of rows and columns of contacts to allow for routing of traces to the contacts
INTEL CORP9 citations70
US6885102B2Apr 26, 2005
Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts
INTEL CORP9 citations70
US7282796B2Oct 16, 2007
Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts
INTEL CORP1 citations59